Resin Composition for Ultra-Fine Hole Patterns
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Solution Overview
Problem
Current resist technologies face challenges in forming high-resolution, fine hole patterns with excellent cross-sectional shape rectangularity and local pattern dimension uniformity, particularly for hole patterns with pore diameters of 60 nm or less, due to issues like pattern deterioration and reverse-tapered shapes during the lithography process.
Innovation Solution
An actinic ray-sensitive or radiation-sensitive resin composition is developed, comprising a resin with a specific repeating unit, an acid generator, and a resin containing fluorine or silicon atoms, which improves solubility and reaction uniformity, allowing for the formation of negative-type patterns with enhanced rectangularity and uniformity through chemical amplification and liquid immersion exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a chemically amplified resist is applied to liquid immersion exposure, then sensitivity is improved, but the resist layer degrades and components bleed into the immersion liquid
Solution Approach 1:
A protective coating layer is introduced as an intermediary between the chemically amplified resist and the immersion liquid. This coating prevents direct contact and chemical interaction, stopping resist degradation and component bleeding while allowing the resist to maintain high sensitivity during exposure.
Solution Approach 2:
The resist system is transformed into a composite structure consisting of the chemically amplified resist combined with a protective coating material. This composite approach allows the resist to provide high sensitivity while the coating material provides chemical stability and prevents contamination of the immersion liquid.
2Manufacturing precision
If positive-type chemical amplification is used, then isolated lines and dot patterns are formed satisfactorily, but pattern shape deteriorates in isolated spaces and fine hole patterns
Solution Approach 1:
The invention changes the chemical parameters of the resist system by incorporating specific base compounds and acid generators that modify the chemical amplification behavior. This allows the resist to maintain good performance for isolated lines and dots while improving pattern shape fidelity in isolated spaces and fine hole patterns through controlled chemical reactions.
3Manufacturing precision
If conventional resist composition is used for ultra-fine hole patterns, then local pattern dimension uniformity and cross-sectional rectangularity cannot be achieved
Solution Approach 1:
The resist composition parameters are optimized by selecting specific base compounds with appropriate basicity and acid generators with suitable decomposition characteristics. These parameter changes enable precise control over the chemical amplification process, achieving both local pattern dimension uniformity and excellent cross-sectional rectangularity in ultra-fine hole patterns.
Solution Approach 2:
A composite resist system is created by combining specifically selected base compounds, acid generators, and other additives in optimized ratios. This composite formulation works synergistically to improve both local pattern dimension uniformity and cross-sectional shape rectangularity beyond what conventional single-component resists can achieve.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition enables the formation of hole patterns with excellent cross-sectional shape rectangularity and local pattern dimension uniformity, effectively addressing the challenges of pattern deterioration and reverse-tapered shapes, and is particularly effective for forming ultra-fine hole patterns.
Implementation Method 1
a compound (B) generating organic acid by irradiation of actinic ray or radiation
Implementation Method 2
an image forming method in which acid is generated by an acid generator of exposed area being decomposed by exposure, an alkali-insoluble group is changed to an alkali-soluble group by post exposure bake (PEB) using the acid generated as a reaction catalyst
Data Source
AI summary
An actinic ray-sensitive or radiation-sensitive resin composition of the present invention includes a resin (P) having a repeating unit (a) represented by following General Formula (I), a compound (B) generating organic acid by irradiation of actinic ray or radiation, and 1% by mass or more of a resin (C) which has at least one of a fluorine atom and a silicon atom and is different from the resin (P) with regard to total solids of the actinic ray-sensitive or radiation-sensitive resin composition,wherein, in General Formula (I), R0 represents a hydrogen atom or a methyl group, and each of R1, R2, and R3 independently represents a straight chain or branched alkyl group.