Radiation-Sensitive Resin Composition for Lithography
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Solution Overview
Problem
Current radiation-sensitive resin compositions for microfabrication, particularly in semiconductor manufacturing, face challenges in achieving high integrity, resistance to pattern collapse, and optimal performance under far ultraviolet and electron beam exposure, with limitations in line width roughness and mask error enhancement factor.
Innovation Solution
A radiation-sensitive resin composition comprising a compound represented by a specific formula, which generates an acid upon irradiation, combined with a base polymer, and optionally including a crosslinking agent, fluorine atom-containing polymer, and acid diffusion control agent, to enhance sensitivity, transparency, and resistance to pattern collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If conventional radiation-sensitive resin compositions are used, then basic lithography functionality is achieved, but transparency and sensitivity to far ultraviolet rays and electron beams are insufficient
Solution Approach 1:
The patent employs a composite material system consisting of a base polymer (polymer B) with specific functional groups combined with a radiation-sensitive compound (compound A) having a particular molecular structure with fluorinated groups. This composite approach allows the resin composition to simultaneously achieve high transparency to far ultraviolet rays and high sensitivity to radiation, as the base polymer provides optical clarity while the radiation-sensitive compound ensures efficient acid generation upon irradiation.
Solution Approach 2:
The patent optimizes specific parameters including the molecular weight and structure of the base polymer, the concentration and structure of the radiation-sensitive compound, and the ratio between different components. By carefully controlling these parameters, the composition achieves enhanced transparency and sensitivity without compromising other lithography performance metrics.
2Use of energy by moving object
If higher sensitivity is achieved, then lithography performance improves, but resistance to pattern collapse deteriorates
Solution Approach 1:
The patent introduces a crosslinking agent that selectively crosslinks polymer chains in specific regions of the resist film. This creates local structural reinforcement that enhances pattern collapse resistance in critical areas while maintaining the high sensitivity characteristics of the overall composition. The crosslinking occurs preferentially in regions requiring mechanical strength without compromising the radiation response of the bulk material.
Solution Approach 2:
The resin composition forms a composite structure where the base polymer provides radiation sensitivity, the crosslinked network provides mechanical strength, and optional additives provide additional functional benefits. This multi-component composite approach allows simultaneous optimization of sensitivity and pattern collapse resistance.
3Manufacturing precision
If line width roughness is reduced, then manufacturing precision improves, but mask error enhancement factor increases
Solution Approach 1:
The patent carefully balances the concentration of base polymer and radiation-sensitive compound, along with optimizing the molecular weight and structural parameters of these components. This parameter optimization achieves smooth line widths with reduced roughness while controlling the mask error enhancement factor through controlled acid diffusion characteristics inherent in the composition design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition demonstrates improved transparency and sensitivity to far ultraviolet rays and electron beams, along with enhanced resistance to pattern collapse and mask error enhancement factor, thereby achieving superior lithography performance.
Implementation Method 1
an acid generating agent that generates an acid by irradiation with a radioactive ray
Implementation Method 2
improved transparency and sensitivity to far ultraviolet rays and electron beams
Data Source
AI summary
A radiation-sensitive resin composition includes a compound represented by a formula (1), and a base polymer. A represents —CO— or —CH2—. R1 represents a hydrocarbon group having 1 to 30 carbon atoms, a heterocyclic group having 3 to 30 ring atoms, or a combination of a first group and a second group. The first group is —CO—, —COO—, —OCO—, —O—CO—O—, —NHCO—, —CONH—, —NH—CO—O—, —O—CO—NH—, —NH—, —S—, —SO—, —SO2—, —SO2—O— or a combination thereof, and the second group is a hydrocarbon group having 1 to 30 carbon atoms, a heterocyclic group having 3 to 30 ring atoms or a combination thereof. A part or all of hydrogen atoms included in the hydrocarbon group and the heterocyclic group are not substituted or substituted. M+ represents a monovalent cation.