Resin Composition for Lithography Pattern Resolution and Sensitivity
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Solution Overview
Problem
Current photosensitive compositions for pattern formation in ultra-microlithography and other photofabrication processes face challenges in achieving high sensitivity, good exposure dose dependency, resolution, roughness characteristics, focus latitude, and reduced scum formation, especially when using X-ray, electron beam, or EUV light.
Innovation Solution
A specific actinic ray-sensitive or radiation-sensitive resin composition is developed, incorporating a resin that decomposes in an alkali developer, a compound generating acid upon irradiation, and a basic compound, along with a compound represented by a specific formula, to enhance pattern formation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photosensitive composition is used, then basic pattern formation is achieved, but sensitivity and resolution are insufficient for ultra-microlithography
Solution Approach 1:
The patent uses a composite resin system combining polyhydroxystyrene (provides resolution and sensitivity) with polycycloolefin (improves roughness and focus latitude). This composite approach allows simultaneous optimization of multiple performance parameters that cannot be achieved with single resins alone.
Solution Approach 2:
The patent systematically optimizes the molecular weight, weight average molecular weight number distribution, and compositional ratios of resin components. By controlling these parameters within specific ranges, the composition achieves enhanced sensitivity and resolution while maintaining good roughness characteristics.
2Productivity
If higher sensitivity is achieved, then exposure efficiency improves, but pattern profile and scum reduction deteriorate
Solution Approach 1:
The patent controls the weight average molecular weight of polyhydroxystyrene within 10,000-100,000 and the ratio of polyhydroxystyrene to polycycloolefin within 95:5 to 50:50. These parameter optimizations enable high sensitivity while maintaining excellent pattern profiles and minimizing scum formation.
Solution Approach 2:
The patent introduces specific additives including alicyclic alcohol compounds and carboxylic acid compounds that locally modify the resin behavior during exposure and development. These additives provide targeted improvements in pattern profile quality without compromising overall sensitivity.
3Manufacturing precision
If resolution is improved, then pattern definition enhances, but roughness characteristics and focus latitude worsen
Solution Approach 1:
The polycycloolefin component with specific molecular weight characteristics (10,000-100,000) provides excellent focus latitude and roughness control, while the polyhydroxystyrene component delivers high resolution. The synergistic combination allows simultaneous achievement of sharp pattern definition and robust focus tolerance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved sensitivity, exposure dose dependency, resolution, roughness characteristics, and focus latitude while reducing scum formation, resulting in better pattern profiles.
Implementation Method 1
a compound capable of generating an acid upon irradiation with an actinic ray or radiation
Data Source
AI summary
An actinic ray-sensitive or radiation-sensitive resin composition, and a resist film and a pattern forming method using the composition are provided, the composition including (A) a compound capable of decomposing by the action of an acid to increase the solubility of the resin (A) in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a basic compound; and (D) a specific compound containing at least two specific alicyclic hydrocarbon groups each substituted with a hydroxyl group.