Radiation-Sensitive Resin Composition for High-Resolution Semiconductor Lithography
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Solution Overview
Problem
Current radiation-sensitive resin compositions used in microfabrication for semiconductor devices face challenges in achieving high resolution, wide focus latitude, and maintaining pattern shape integrity, especially with the miniaturization of semiconductor devices, leading to issues like low focus latitude and pattern form degradation.
Innovation Solution
A radiation-sensitive resin composition comprising an acid-dissociable group-containing resin, a radiation-sensitive acid generator, and a solvent, where the resin includes a copolymer with an acid-dissociable group-containing repeating unit exceeding 55 mol% and a mass content of 90% or more, along with a combination of acid generators to enhance sensitivity and etching resistance, effectively responding to deep ultraviolet rays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional radiation-sensitive resin compositions are used, then basic resist functionality is achieved, but resolution and focus latitude deteriorate due to miniaturization requirements
Solution Approach 1:
The patent changes the chemical composition parameters of the resin by incorporating specific repeating units with acid-dissociable groups (carboxylic acid, sulfonic acid, phosphoric acid, or carboxylic ester groups) in controlled amounts. This modifies the resin's response to radiation and subsequent chemical amplification, enabling high resolution while maintaining focus latitude through optimized chemical reactivity.
Solution Approach 2:
The patent creates a composite resin system combining multiple types of repeating units including acid-dissociable group-containing units, alicyclic hydrocarbon units, and units with specific functional groups. This composite structure synergistically provides both high resolution through acid generation and wide focus latitude through controlled solubility changes during development.
2Productivity
If miniaturization is pursued for higher integration, then device density improves, but pattern form degradation occurs
Solution Approach 1:
The patent introduces repeating units with specific local chemical properties (acid-dissociable groups at defined positions in the polymer chain) that create localized zones of high chemical reactivity upon radiation exposure. This local chemical transformation enables precise pattern definition even at miniaturized dimensions, preventing pattern form degradation while supporting higher device integration density.
3Measurement precision
If high acid-dissociable group content is used, then sensitivity improves, but etching resistance deteriorates
Solution Approach 1:
The patent applies partial action by incorporating acid-dissociable group-containing repeating units at optimized concentrations (not maximum possible content) balanced with alicyclic hydrocarbon repeating units. This partial incorporation provides sufficient sensitivity for radiation detection while the alicyclic components maintain structural integrity and etching resistance, achieving the optimal trade-off between sensitivity and strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition exhibits high radiation transparency, superior resist properties with excellent sensitivity, dry etching resistance, high resolution, and improved focus latitude, resulting in better pattern shape formation suitable for advanced semiconductor manufacturing.
Implementation Method 1
a radiation-sensitive acid generator (hereinafter referred to as 'acid generator (B)') which is a component generating an acid upon irradiation
Implementation Method 2
chemically-amplified radiation-sensitive compositions utilizing a chemical amplification effect between a component having an acid-dissociable functional group and an acid generator
Data Source
AI summary
A radiation-sensitive resin composition includes an acid-dissociable group-containing resin, a radiation-sensitive acid generator, and a solvent. The acid-dissociable group-containing resin includes a copolymer containing a repeating unit. The reparing unit includes an acid-dissociable group-containing repeating unit in an amount of more than about 55 mol % of a total amount of the repeating units in the copolymer. A content of the copolymer in the acid-dissociable group-containing resin is about 90 mass % or more of a total amount of the acid-dissociable group-containing resin.