Resin Composition for High-Resolution Lithography Patterns
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Solution Overview
Problem
Current resist compositions face challenges in achieving high sensitivity, resolution, and pattern profile quality, especially when forming fine isolated space patterns and hole patterns with dimensions below 100 nm and 50 nm, respectively, due to trade-offs between these properties.
Innovation Solution
A radiation-sensitive resin composition incorporating specific repeating units, such as those represented by formulas (1-1) and (1-2), which provide high sensitivity and resolution by controlling the content and structure of acetal-protected carboxylic acid groups, allowing for effective acid deprotection and improved developer solubility, enabling the formation of high-resolution patterns with excellent space width roughness and local pattern dimension uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If higher sensitivity is pursued in resist composition, then sensitivity is improved, but pattern profile and resolution deteriorate
Solution Approach 1:
The patent applies parameter changes by precisely controlling the molar ratio of specific repeating units in the resin. The resin contains repeating units with acetal-protected carboxylic acid groups (formula 1-1) at 35-85 mol% and hydroxystyrene units (formula 1-2) at 15-65 mol%, with their combined content being 50-95 mol% of total repeating units. This specific compositional parameter optimization enables simultaneous achievement of high sensitivity and good pattern profile without trade-off.
Solution Approach 2:
The patent uses composite materials by combining two types of repeating units with different functions in a specific ratio. The acetal-protected carboxylic acid units provide sensitivity enhancement through acid deprotection, while the hydroxystyrene units contribute to pattern profile stability. This composite resin structure, combined with specific additives, achieves both high sensitivity and good resolution simultaneously.
2Productivity
If higher sensitivity is pursued in resist composition, then sensitivity is improved, but resolution deteriorates
Solution Approach 1:
The patent optimizes the compositional parameters of the resin by controlling the content of repeating units with acetal-protected carboxylic acid groups (formula 1-1) at 35-85 mol% and hydroxystyrene units (formula 1-2) at 15-65 mol%. This specific parameter range enables the resist to achieve both high sensitivity (shorter exposure time) and high resolution (sharper pattern definition) without compromise.
Solution Approach 2:
The patent introduces acid deprotection as an intermediary mechanism. The acetal-protected carboxylic acid groups act as intermediaries that, upon exposure, undergo deprotection to generate carboxylic acid groups. This intermediary step enhances the sensitivity of the resist by amplifying the chemical change in response to exposure, while maintaining resolution through controlled acid diffusion.
3Manufacturing precision
If finer isolated space pattern with space width of 100 nm or less is formed, then resolution is improved, but sensitivity and space width roughness performance deteriorate
Solution Approach 1:
The patent achieves high sensitivity for sub-100 nm isolated space patterns by optimizing the resin composition parameters. The specific molar ratio of acetal-protected carboxylic acid units (35-85 mol%) to hydroxystyrene units (15-65 mol%) creates a chemical amplification effect that enhances sensitivity, enabling formation of fine patterns at lower exposure doses while maintaining resolution and smooth space width.
4Manufacturing precision
If hole pattern with fine hole diameter of 50 nm or less is formed, then resolution is improved, but exposure latitude and local pattern dimension uniformity deteriorate
Solution Approach 1:
The patent optimizes the compositional parameters to achieve excellent local pattern dimension uniformity (Local-CDU) for sub-50 nm hole patterns. The controlled content of acetal-protected carboxylic acid units (35-85 mol%) and hydroxystyrene units (15-65 mol%), along with their combined content (50-95 mol%), ensures uniform acid generation and diffusion characteristics, resulting in consistent hole diameter across the pattern field with good exposure latitude.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent sensitivity, resolution, and space width roughness for fine isolated space patterns and high resolution, good exposure latitude, and local pattern dimension uniformity for hole patterns with sub-100 nm and sub-50 nm features, respectively, by optimizing the content and structure of acetal-protected carboxylic acid groups.
Implementation Method 1
an actinic ray-sensitive or radiation-sensitive resin composition... allowing for effective acid deprotection
Implementation Method 2
actinic ray-sensitive or radiation-sensitive resin composition... in the ultramicrolithography process
Data Source
AI summary
There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin containing a repeating unit represented by the first specific formula and a repeating unit represented by the second specific formula, wherein the content of the repeating unit represented by the first specific formula is 35 mol % or more based on all repeating units in the resin (A), a resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition.