Resin Composition for Printed Wiring Boards with Low Dielectric Constant
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Solution Overview
Problem
Existing resin compositions for printed wiring boards fail to sufficiently reduce the dielectric constant and achieve adequate peel strength, as they either have insufficient dielectric constant reduction or low peel strength when using anhydride-based hardeners with multiple anhydride groups or styrene-maleic anhydride copolymers (SMA) alone.
Innovation Solution
A resin composition combining an epoxy resin with a hardener containing styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group, where the acid value of SMA is between 300 to 550 and the ratio of anhydride equivalents to epoxy equivalents is between 0.05 to 0.5, and the total ratio of anhydride and SMA equivalents to epoxy equivalents is between 0.5 to 1.2, to enhance both dielectric constant reduction and peel strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an anhydride-based hardener with multiple anhydride groups is used, then the dielectric constant is reduced, but the peel strength becomes insufficient
Solution Approach 1:
The patent combines two types of hardeners (anhydride-based hardener and styrene-maleic anhydride copolymer) in a specific ratio to achieve both low dielectric constant and high peel strength. The anhydride-based hardener contributes to dielectric constant reduction while the SMA copolymer enhances peel strength, and their synergistic combination resolves the contradiction between these two properties.
Solution Approach 2:
The patent specifies precise parameter ranges: the ratio of anhydride group equivalent number to epoxy group equivalent number is 0.05-0.5, and the total ratio of anhydride and SMA equivalent numbers to epoxy group equivalent number is 0.5-1.2. By optimizing these parameters, the invention achieves both low dielectric constant and high peel strength simultaneously.
2Object-affected harmful factors
If a styrene-maleic anhydride copolymer is used as hardener, then the dielectric constant is reduced, but the peel strength remains low
Solution Approach 1:
The patent merges the styrene-maleic anhydride copolymer with an anhydride-based hardener in a specific composition ratio. The SMA copolymer provides dielectric constant reduction while the anhydride-based hardener compensates for the insufficient peel strength, achieving both properties simultaneously through their synergistic effect.
Solution Approach 2:
The invention creates a composite hardener system combining two different chemical components (SMA copolymer and anhydride-based hardener) with complementary properties. This composite approach allows the system to achieve both low dielectric constant and high peel strength that neither component could achieve alone.
3Strength
If the anhydride to epoxy ratio is increased to improve peel strength, then the dielectric constant reduction becomes insufficient
Solution Approach 1:
The patent optimizes the ratio parameters within specific ranges: anhydride group equivalent number to epoxy group equivalent number ratio of 0.05-0.5, and total anhydride and SMA equivalent number to epoxy group equivalent number ratio of 0.5-1.2. This parameter optimization ensures both adequate peel strength and sufficient dielectric constant reduction.
Solution Approach 2:
By combining two hardener types with different functional characteristics, the patent achieves a balanced performance where the total hardener content (expressed as equivalent ratio) provides sufficient dielectric constant reduction while the specific composition maintains adequate peel strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed resin composition effectively decreases the dielectric constant and improves peel strength, while maintaining a balance to prevent gelation issues and ensure manufacturing feasibility of prepregs and printed wiring boards.
Implementation Method 1
an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer and an anhydride having only one anhydride group in a molecule
Implementation Method 2
An acid value of the styrene-maleic anhydride copolymer is from 300 to 550, inclusive... improve the peel strength by using the anhydride and the styrene-maleic anhydride copolymer having a predetermined acid value
Data Source
AI summary
Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive.