Resin Composition for Printed Wiring Boards with Low Dissipation Factor
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current resin compositions for printed wiring boards lack materials with low dissipation factors and high water absorption resistance, particularly for high-frequency applications, where miniaturization and high-density wiring are required.
Innovation Solution
A resin composition comprising a polyphenylene ether resin and a mono(C6-C20 alkyl)diallyl isocyanurate, which exhibits low relative permittivity and dissipation factor, along with excellent water absorption resistance and adhesion to metals, is developed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin compositions are used for printed wiring boards, then general insulating properties are achieved, but dissipation factor is high and water absorption resistance is poor for high-frequency applications
Solution Approach 1:
The patent changes the chemical structure parameters of the crosslinking agent from conventional triallyl isocyanurate to monoalkyl diallyl isocyanurate with specific alkyl chain lengths (C6-C20). This structural parameter change reduces polar groups and optimizes molecular packing, achieving lower dissipation factor (0.004 or less at 10 GHz) and lower relative permittivity (3.5 or less at 10 GHz) for high-frequency applications
Solution Approach 2:
The patent creates a composite resin system combining polyphenylene ether resin with monoalkyl diallyl isocyanurate crosslinking agent. This composite formulation achieves synergistic effects where the PPE resin provides base insulating properties while the specific crosslinking agent contributes to low dissipation factor and enhanced water absorption resistance, resulting in a material optimized for high-frequency printed wiring boards
2Reliability
If resin composition is optimized for low dissipation factor, then high-frequency characteristics improve, but adhesion to metals and water absorption resistance may be compromised
Solution Approach 1:
The patent optimizes the alkyl chain length parameter (C6-C20) in monoalkyl diallyl isocyanurate to achieve balanced performance. The specific chain length range provides hydrophobicity for water absorption resistance while maintaining molecular flexibility for metal adhesion, all while preserving low dissipation factor properties essential for high-frequency applications
3Reliability
If resin composition is optimized for low dissipation factor, then high-frequency characteristics improve, but water absorption resistance may be compromised
Solution Approach 1:
The patent modifies the chemical composition by selecting alkyl chains with 6-20 carbon atoms in the monoalkyl diallyl isocyanurate. This parameter change increases hydrophobicity and reduces water absorption while maintaining the low dissipation factor and relative permittivity needed for high-frequency performance, achieving water absorption resistance without sacrificing dielectric properties
Data Source
AI summary
This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C6-C20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.