Resin Composition for Low Roughness Adhesive Layers
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Solution Overview
Problem
Current resin compositions for adhesive films, prepregs, multilayered printed wiring boards, and semiconductor devices fail to achieve a balance between low surface roughness, sufficient peel strength for plated conductive layers, and maintaining glass transition temperature and thermal expansion coefficient.
Innovation Solution
A resin composition comprising epoxy resin, alkoxy oligomer, and inorganic filler, where the alkoxy oligomer is reacted with the inorganic filler to form a reaction product, which is then added to the epoxy resin, optimizing the carbon amount per unit surface area and viscosity to achieve desired properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a resin composition contains silicone alkoxy oligomer and inorganic filler, then adhesive properties are improved, but surface roughness increases
Solution Approach 1:
The patent changes the chemical parameters of the resin composition by specifying precise ratios of epoxy resin to alkoxy oligomer (95:5 to 50:50 by mass), controlling the carbon amount per unit surface area of inorganic filler (0.03 to 0.20 mg/m²), and adjusting viscosity ranges (100 to 10,000 cP). These parameter optimizations enable the resin to achieve both low surface roughness (Ra ≤ 0.03 μm) and sufficient adhesive strength simultaneously.
Solution Approach 2:
The patent creates a composite resin composition system combining epoxy resin, alkoxy oligomer, and inorganic filler with specific surface treatments. The inorganic filler undergoes surface treatment with silane coupling agents or other treatments to create optimal interfaces, achieving a balance between adhesion promotion and surface smoothness that neither component could achieve alone.
2Strength
If alkoxy oligomer content is increased to improve adhesion, then peel strength increases, but glass transition temperature decreases
Solution Approach 1:
The patent optimizes the ratio of epoxy resin to alkoxy oligomer within specific ranges (95:5 to 50:50 by mass) and controls the absolute content of alkoxy oligomer (0.1 to 10 parts by mass per 100 parts epoxy resin). This parameter control ensures peel strength ≥ 0.3 kgf/cm while maintaining glass transition temperature within 50°C to 150°C, achieving both adhesion and thermal stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition forms an insulating layer with low arithmetic mean and root mean square roughness, enabling a plated conductive layer with sufficient peel strength while maintaining thermal performance.
Implementation Method 1
at least part of the alkoxy oligomer (B) is reacted with the inorganic filler (C) to form a reaction product
Data Source
AI summary
Resin compositions which contain an epoxy resin, an alkoxy oligomer, and an inorganic filler provide insulating layers that have a surface with not only low arithmetic mean roughness but also low root mean square roughness in a wet roughening step and that are capable of forming thereon a plated conductive layer having a sufficient peel strength that can be formed while maintaining the glass transition temperature and thermal expansion coefficient.