Radiation-Sensitive Resin Composition for Narrower L/S Pattern Spaces
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Solution Overview
Problem
Existing actinic ray-sensitive or radiation-sensitive resin compositions fail to prevent bridge defects in narrow space widths during the formation of line-and-space patterns, which are required for further miniaturization in semiconductor elements.
Innovation Solution
Incorporating a resin with an acid-decomposable group, a photoacid generator, and a boron-containing compound, along with an acid diffusion control agent, to achieve a specific atomic ratio that enhances light absorption and radical anion generation, thereby reducing the occurrence of bridge defects in narrow spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional actinic ray-sensitive or radiation-sensitive resin composition is used, then the pattern formation process is straightforward, but bridge defects occur in narrow space widths preventing further miniaturization
Solution Approach 1:
The invention changes the chemical composition parameters of the resin by incorporating specific compounds: a resin with acid-decomposable groups (generating polar groups), a photoacid generator, and a boron-containing compound. This compositional parameter change enables narrower space widths without bridge defects while maintaining pattern formation capability
Solution Approach 2:
The invention creates a composite resin system combining multiple functional components: the acid-decomposable resin, photoacid generator, and boron-containing compound. This composite material approach synergistically improves both pattern resolution and reduces bridge defects in narrow spaces
2Productivity
If the exposure dose is increased to improve sensitivity, then pattern formation sensitivity improves, but the space width required to prevent bridge defects does not narrow
Solution Approach 1:
The invention changes the chemical reaction parameters through the boron-containing compound and photoacid generator system, enabling the resin to achieve adequate reaction at lower exposure doses. This parameter change simultaneously improves sensitivity and narrows the space width required to prevent bridge defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a narrow space width at which bridge defects start to occur, enabling the formation of finer patterns with improved resolution and sensitivity without relying on increased exposure dose.
Implementation Method 1
a photoacid generator included in portions to be exposed is decomposed by light irradiation to generate an acid
Implementation Method 2
an alkali-insoluble group of a resin included in an actinic ray-sensitive or radiation-sensitive resin composition is changed, by the catalytic action of the generated acid, to an alkali-soluble group
Implementation Method 3
Incorporating a resin with an acid-decomposable group, a photoacid generator, and a boron-containing compound, along with an acid diffusion control agent, to achieve a specific atomic ratio that enhances light absorption and radical anion generation
Data Source
AI summary
A first object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition that provides a narrow space width at which bridge defects start to occur when an L/S pattern is formed.A second object of the present invention is to provide a resist film, a pattern forming method, and a method for producing an electronic device that are related to the actinic ray-sensitive or radiation-sensitive resin composition.The actinic ray-sensitive or radiation-sensitive resin composition according to the present invention includes a resin having a group that is decomposed by an action of an acid to generate a polar group, a photoacid generator, and a boron-containing compound and satisfies a requirement 1.Requirement 1: A value A determined by an equation (1) is 0.120 or more.


