Radiation-Sensitive Resin Composition for Low LWR Microfabrication

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current radiation-sensitive resin compositions for microfabrication, particularly in the production of integrated circuit devices, face challenges in achieving high resolution and low line width roughness (LWR) while maintaining pattern collapse resistance and minimal mean exposure field (MEEF) when using deep ultraviolet rays or charged particle rays.

Innovation Solution

A radiation-sensitive resin composition incorporating a compound represented by a specific formula that includes a monovalent group with —CO—, —NH—, and —SO2— groups, along with a polymer base resin, acts as an acid generator, enhancing post-development pattern collapse resistance, LWR, and MEEF through controlled acid diffusion and increased acidity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional radiation-sensitive resin compositions are used, then manufacturing process is simpler, but resolution and line width roughness (LWR) are insufficient

Engineering Contradiction:
Improveresolution and LWRVSAvoidcomposition complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent employs a composite resin composition incorporating specific fluorinated compounds (e.g., perfluorocyclobutyl methacrylate) combined with conventional polymers. This composite approach achieves superior resolution and low LWR by leveraging the unique properties of fluorinated groups while maintaining process compatibility

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention modifies the chemical composition parameters by introducing fluorinated compounds with specific structural features (CF2 groups, perfluorocyclobutyl rings) to alter the resin's interaction with radiation and development chemicals, thereby improving resolution without requiring complete system redesign

Inventive Principle:
Principle #35Parameter changes

2Productivity

If higher sensitivity is achieved through increased acid generation, then exposure efficiency improves, but pattern collapse resistance deteriorates

Engineering Contradiction:
Improveexposure efficiencyVSAvoidpattern collapse resistance
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The fluorinated compounds are strategically positioned in the resin matrix to create localized zones of controlled acid generation and diffusion. This local quality control allows high sensitivity in exposed regions while maintaining pattern integrity through restricted acid spread to unexposed regions

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The fluorinated compounds act as intermediary substances that mediate between the acid generator and the polymer matrix, controlling acid diffusion rates and interaction dynamics to balance sensitivity and pattern collapse resistance

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If line width roughness (LWR) is reduced through composition optimization, then manufacturing precision improves, but composition complexity increases

Engineering Contradiction:
ImproveLWRVSAvoidresin composition complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent achieves low LWR by optimizing specific parameters of the fluorinated compound structure (e.g., ratio of CF2 groups, ring size of perfluorocyclobutyl) and their concentration in the resin, rather than fundamentally changing the composition architecture

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition exhibits excellent post-development pattern collapse resistance, low LWR, and small MEEF, making it suitable for high-resolution microfabrication processes using deep ultraviolet rays or charged particle rays.

Implementation Method 1

A radiation-sensitive resin composition that utilizes a chemical amplification effect due to an acid-labile functional group-containing component and an acid generator has been proposed

Methodology Applied
Scientific EffectChemical amplification:

Implementation Method 2

enhancing post-development pattern collapse resistance, LWR, and MEEF through controlled acid diffusion and increased acidity

Methodology Applied
Scientific EffectAcid diffusion: Diffusion

Data Source

PatentUS8889335B2Radiation-sensitive resin composition
Publication Date: 2014.11.18 JSR CORPORATION
  • US8889335B2 patent drawing
  • US8889335B2 patent drawing
  • US8889335B2 patent drawing

AI summary

A radiation-sensitive resin composition includes a compound represented by a formula (1), and a polymer that serves as a base resin. R1 is a monovalent group that includes at least two groups of —CO—, —NH—, —S—, and —SO2—, the at least two groups being each identical or different. A is a divalent hydrocarbon group or a divalent fluorohydrocarbon group having 1 to 5 carbon atoms. R is a fluorine atom or a hydrogen atom. a is an integer from 1 to 4. In a case where a plurality of R are present, each of the plurality of R is either identical or different. M+ is a monovalent cation.