Resin Composition for Multilayer PCBs with Low Thermal Expansion
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Solution Overview
Problem
Current substrate materials for printed wiring boards face challenges in achieving high-frequency characteristics, low thermal expansion, and adhesiveness to conductors, while also requiring improved handleability and appearance.
Innovation Solution
A resin composition comprising a maleimide compound with a specific divalent hydrocarbon group and a thermoplastic resin, which includes a saturated or unsaturated divalent hydrocarbon group, and an aromatic maleimide compound, is used to create a laminate and multilayer printed wiring board with enhanced dielectric properties and thermal expansion characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polyphenylene ether-based resins are used for high-frequency characteristics, then low relative dielectric constant and low dielectric loss tangent are achieved, but thermal expansion characteristics and adhesiveness to conductors are insufficient
Solution Approach 1:
The invention uses a composite resin system combining polyphenylene ether (PPE) with maleimide-modified compounds and aromatic diamine compounds. This composite approach allows the PPE to provide low dielectric constant and loss tangent for high-frequency performance, while the maleimide-aromatic diamine addition polymerization network provides dimensional stability and controlled thermal expansion characteristics. The synergistic combination resolves the contradiction between high-frequency electrical properties and thermal stability.
Solution Approach 2:
The invention modifies the chemical structure parameters of the resin system by introducing maleimide groups with specific hydrocarbon chains (8-100 carbon atoms) and reacting them with aromatic diamines. This chemical modification changes the physical parameters including thermal expansion coefficient and adhesion properties, while maintaining the low dielectric properties of PPE. The controlled addition polymerization creates a crosslinked network that stabilizes thermal expansion without significantly increasing dielectric loss.
2Stability of the object's composition
If maleimide compounds with aromatic rings are used to improve thermal expansion characteristics, then dimensional stability is enhanced, but high-frequency dielectric characteristics may deteriorate
Solution Approach 1:
The invention applies local quality by using maleimide compounds with aliphatic hydrocarbon groups (8-100 carbon atoms) rather than aromatic rings directly in the maleimide structure. The aliphatic chains provide flexibility and maintain low dielectric loss, while the addition polymerization with aromatic diamines creates localized crosslinked regions that control thermal expansion. This local modification approach prevents aromatic rings from directly interfering with high-frequency signal transmission while still achieving dimensional stability.
3Strength
If reinforcing base materials are added to improve mechanical strength and handleability, then structural integrity is enhanced, but manufacturing complexity and production costs increase
Solution Approach 1:
The invention changes the chemical composition parameters of the resin itself by incorporating maleimide compounds and aromatic diamines that form a crosslinked network during addition polymerization. This chemical strengthening provides the necessary mechanical strength and handleability for laminate production without requiring physical reinforcing materials like glass fabrics or paper bases. The resin matrix itself becomes structurally adequate, eliminating the need for separate reinforcing components and simplifying manufacturing.
Data Source
AI summary
The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.