Resin Composition for Electronic Insulating Films Preventing Pattern Melting
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Solution Overview
Problem
Conventional polyimide and polybenzoxazole resins used in electronic parts face issues with pattern melting during final heating steps due to dehydration reactions, leading to undesired pattern loss and gas generation, which affects the integrity of insulating and surface protection films.
Innovation Solution
A resin composition comprising a polymer with acidic functional groups, a solvent, and a specific compound that reacts with these groups to prevent melting and gas generation, including a compound with an alkoxysilyl or ethenyl group to enhance film stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polyimide precursor or polybenzoxazole precursor is heated at the final heating step at a temperature higher than the glass transition point, then dehydration ring closure reaction progresses, but the relief pattern melts and the opening pattern size becomes smaller or disappears
Solution Approach 1:
The patent applies preliminary action by introducing a cross-linking component into the resin composition before the final heating step. This cross-linking component undergoes cross-linking reactions in advance during the heating process, forming a three-dimensional network structure that prevents the relief pattern from melting at high temperatures. The cross-linking occurs before the dehydration ring closure reaction completes, creating structural integrity that maintains the relief pattern shape even when heated above the glass transition point.
2Shape
If a cross-linking component is added to prevent pattern melting, then pattern stability improves, but the cross-linking component may sublime or decompose generating gas that causes contamination and cracks
Solution Approach 1:
The patent applies parameter changes by carefully controlling the molecular weight, functional group type, and concentration of the cross-linking component. By selecting a cross-linking component with appropriate parameters (molecular weight of 100-10,000, specific functional groups), the resin achieves adequate cross-linking for pattern stability while minimizing sublimation and decomposition. The patent also controls the heating rate and temperature profile to ensure cross-linking occurs before excessive gas generation.
Solution Approach 2:
The patent applies composite materials by creating a multi-component resin system that combines the polyimide precursor or polybenzoxazole precursor with a specifically selected cross-linking component. This composite resin composition synergistically combines the heat-resistant properties of the precursor with the cross-linking properties of the added component, achieving both pattern stability and reduced gas generation through the interaction between components.
3Ease of manufacture
If conventional photo-sensitive polyimide or polybenzoxazole resin is used, then photo-sensitivity is achieved, but the film melts during final heating causing loss of relief pattern
Solution Approach 1:
The patent applies merging by combining two previously separate functions into one integrated resin composition: the photo-sensitivity function (from the polyimide precursor or polybenzoxazole precursor) and the heat-resistant cross-linking function (from the added cross-linking component). This unified composition maintains the ease of manufacture through photo-patterning while adding the reliability of heat-resistant film integrity during the final heating step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively prevents pattern melting and reduces gas generation during heating, maintaining pattern integrity and improving the reliability of insulating and surface protection films for electronic parts.
Implementation Method 1
a resin composition for an insulating film or a surface protection film of an electronic part, comprising: (A) a polymer which has a structural unit shown by the following formula (I), and an acidic functional group or a group derived therefrom at both of the terminals
Implementation Method 2
dehydration ring closure reaction of the precursor is in progress during stepwise rising temperature at the final heating step
Implementation Method 3
a method of producing a relief pattern by using the resin composition
Data Source
AI summary
A resin composition includes: (A) a polymer having a structural unit shown by the formula (I), and an acidic functional group or a group derived therefrom at both of the terminals;wherein X1 is a di- to octa-valent organic group, Y1 is a di- to octa-valent organic group, R1 is a hydrogen atom or an organic group having 1 to 20 carbon atoms, R2 is a hydrogen atom or a monovalent organic group, when plural R1s or R2s exist, the plural R1s or R2s may be the same or different, p and q are independently an integer of 0 to 4, l and m are independently an integer of 0 to 2, and n is an integer of 2 or more indicating the number of structural units; (B) a solvent; and (C) a compound shown by formula (II)wherein R3 is a monovalent organic group.