Radiation-Sensitive Resin Composition for Lithography
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Solution Overview
Problem
Current photolithography technologies face challenges in achieving superior sensitivity, LWR performance, and pattern rectangularity, particularly when using short-wavelength radiation, due to limitations in acid diffusion control and solubility differences between exposed and unexposed areas.
Innovation Solution
A radiation-sensitive resin composition incorporating a resin with a specific structural unit, a radiation-sensitive acid generator, and a solvent, which allows for enhanced acid dissociation and improved pattern formation by controlling acid diffusion and solubility differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If short-wavelength radiation is used for photolithography, then pattern resolution is improved, but sensitivity and LWR performance deteriorate due to limited acid diffusion control
Solution Approach 1:
The patent modifies the chemical structure of the resin by introducing specific structural units with formula (1) containing R1-R10 groups and n1-n2 parameters. This structural modification changes the acid diffusion characteristics and solubility properties of the resist material, enabling improved LWR performance and sensitivity while maintaining the resolution benefits of short-wavelength radiation exposure.
Solution Approach 2:
The radiation-sensitive resin composition is formulated as a composite system containing multiple components: the specific resin with structural unit (1), radiation-sensitive acid generator, and solvent. This composite approach combines materials with complementary properties to achieve both high resolution from short-wavelength exposure and controlled acid diffusion for improved sensitivity and LWR performance.
2Reliability
If acid diffusion is increased to improve sensitivity, then pattern rectangularity deteriorates due to loss of exposure precision
Solution Approach 1:
The patent introduces a resin with specific local structural units (formula 1) that create localized acid diffusion control. The R1-R10 groups and cyclic structures in the resin provide spatially differentiated acid interaction properties, allowing acid to diffuse sufficiently for sensitivity while maintaining sharp boundaries for pattern rectangularity through localized solubility changes upon exposure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves superior sensitivity, LWR performance, and pattern rectangularity, enabling high-quality resist pattern formation with improved process stability and resolution.
Implementation Method 1
a radiation-sensitive acid generator
Implementation Method 2
an acid diffused to an unexposed area is captured by a salt exchange reaction
Data Source
AI summary
A radiation-sensitive resin composition includes a resin including a structural unit represented by formula (1), a radiation-sensitive acid generator, and a solvent. R1 is a hydrogen atom, a fluorine atom, or the like. R2 and R3 each independently represent a monovalent hydrocarbon group having 1 to 10 carbon atoms, or the like. R4 is a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or the like. R5 and R6 each independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or the like. R7 and R8 each independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or the like. R9 and R10 each independently represent a monovalent organic group having 1 to 10 carbon atoms, or the like.