Resin Composition for Printed Circuit Boards with Low Dissipation Factor
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Solution Overview
Problem
Conventional resin materials for printed circuit boards face challenges in achieving low dissipation factor, high thermal resistance, and dimensional stability, which are crucial for high-speed data transmission and reliability.
Innovation Solution
A resin composition comprising an unsaturated bond-containing polyphenylene ether resin, a maleimide resin, and a specific compound, which together provide improved properties such as low prepreg viscosity variation, absence of stickiness, high glass transition temperature, and low thermal expansion, enhancing the performance of printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional resin materials are used for printed circuit boards, then manufacturing process is simple, but dissipation factor is high and thermal resistance is low
Solution Approach 1:
The patent uses a composite resin system combining polyphenylene ether resin with maleimide resin and hydroxyl-functional polymer, where each component contributes specific properties: PPE provides low dissipation factor, maleimide resin enhances thermal resistance and dimensional stability, and hydroxyl-functional polymer improves adhesion. This composite approach achieves superior electrical and thermal performance compared to conventional single-resin systems.
2Loss of energy
If high-performance resin materials are used to achieve low dissipation factor and high thermal resistance, then electrical and thermal performance is improved, but dimensional stability deteriorates
Solution Approach 1:
The patent optimizes the molecular weight parameters of the resin components, specifically using PPE with Mn of 1,200-2,200 and maleimide resin with Mn of 300-700. These parameter adjustments ensure that the resin maintains low dissipation factor while achieving high dimensional stability through controlled chain length and intermolecular interactions.
3Loss of energy
If resin composition is optimized for low dissipation factor, then electrical performance is improved, but glass transition temperature decreases
Solution Approach 1:
The patent creates a composite system where polyphenylene ether resin (providing low dissipation factor Df<0.0038) is combined with maleimide resin and hydroxyl-functional polymer. The maleimide resin component specifically contributes to elevating the glass transition temperature to at least 230°C while the PPE component maintains the low dissipation factor, achieving both electrical and thermal performance simultaneously.
4Quantity of substance
If conventional resin materials are used, then material cost is low, but thermal expansion ratio is high
Solution Approach 1:
The patent reduces thermal expansion ratio to less than 2.0% by carefully selecting and optimizing the molecular weight parameters of the resin components. The use of PPE with Mn of 1,200-2,200 and maleimide resin with Mn of 300-700 creates a dense molecular structure with strong intermolecular forces, minimizing thermal expansion while maintaining reliability for high-speed data transmission applications.
Data Source
AI summary
A resin composition comprises: an unsaturated bond-containing polyphenylene ether resin; a maleimide resin of Formula (1); and a compound of Formula (2) or Formula (3). The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength and dissipation factor.