Resin Composition for Printed Circuit Boards with High Heat Resistance
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Solution Overview
Problem
Existing resin compositions for printed circuit boards face challenges in achieving both good dielectric properties and high heat resistance, with issues such as reduced peel strength, increased water absorption, brittleness, and decreased flame retardancy.
Innovation Solution
A resin composition comprising a modified maleimide resin, an active ester resin, and an epoxy resin, with a specific molecular weight distribution and chemical structure, which allows for co-curing and enhances thermal and dielectric performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If styrene-maleic anhydride (SMA) is used as a curing agent for maleimide resin, then dielectric properties are improved, but peel strength is reduced and water absorption increases
Solution Approach 1:
The patent changes the molecular weight parameters of the maleimide resin, specifically controlling the number average molecular weight to 2000-5000 and weight average molecular weight to 5000-10000. This parameter optimization resolves the contradiction by achieving the right balance between dielectric properties and peel strength through precise molecular weight control
Solution Approach 2:
The patent creates a composite resin system by combining maleimide resin with epoxy resin and active ester curing agent. This composite approach allows the system to achieve both good dielectric properties from the maleimide component and improved peel strength through the epoxy component, while the active ester curing agent provides effective crosslinking without the drawbacks of SMA
2Object-affected harmful factors
If epoxy resin is cured with active ester, then water absorption is reduced and toughness is improved, but glass transition temperature is low and heat resistance is insufficient
Solution Approach 1:
The patent merges two resin systems (maleimide resin and epoxy resin) into a single composite system. The maleimide resin component contributes to higher glass transition temperature and heat resistance, while the epoxy resin component provides low water absorption and good toughness. The combination allows both systems to work together synergistically, achieving properties that neither system could achieve alone
Solution Approach 2:
By creating a composite material system combining maleimide resin and epoxy resin with specific weight ratios (maleimide resin 10-50 parts, epoxy resin 50-90 parts by total resin weight), the patent achieves a balance between heat resistance and water absorption resistance that neither pure system could achieve independently
3Temperature
If maleimide resin is used to achieve good dielectric properties, then heat resistance is improved, but flame retardancy decreases
Solution Approach 1:
The patent creates a composite resin system where maleimide resin (providing heat resistance) is combined with epoxy resin and active ester curing agent. This composite structure allows the system to maintain high heat resistance from the maleimide component while achieving good flame retardancy through the synergistic effect of the complete formulation, resolving the contradiction between heat resistance and flame safety
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves high glass transition temperature, low water absorption, low coefficient of thermal expansion, high flame retardancy, and excellent bondability with conductors, making it suitable for high-frequency applications.
Implementation Method 1
a modified maleimide resin (A) obtained by means of reacting a maleimide compound (M) having at least two maleimide groups/molecules with an amine compound (N1) having at least one primary amine group/molecule and an amine compound (N2) having at least two primary amine groups/molecules
Implementation Method 2
the resin composition comprises a modified maleimide resin, an active ester resin, and an epoxy resin, which allows for co-curing and enhances thermal and dielectric performance
Data Source
AI summary
A resin composition, comprising: a modified maleimide resin (A), an active ester resin (B), and an epoxy resin (C); the modified maleimide resin (A) is obtained by means of reacting a maleimide compound (M) having at least two maleimide groups/molecules with an amine compound (N1) having at least one primary amine group/molecule and an amine compound (N2) having at least two primary amine groups/molecules, and the molecular weight distribution is: molecules having a molecular weight between 1000 and 4500 account for 25-60% the total number of molecules.