Resin Composition for Printed Circuit Boards

The patent changes the chemical composition parameters of the resin system by incorporating specific silane compounds (with carbon-carbon unsaturated bonds or epoxy skeletons) and maleimide compounds in controlled ratios. This modifies the crosslinking behavior and network structure to achieve balanced performance: sufficient elastic modulus during reflow while maintaining heat resistance after moisture absorption through optimized molecular architecture

The patent creates a composite resin system combining multiple components: maleimide compounds, silane compounds with specific functional groups, and inorganic fillers. This composite approach allows the material to exhibit both high elastic modulus during processing and maintained heat resistance after moisture exposure, as the different components work synergistically to prevent void formation while providing mechanical support

The patent optimizes the crosslink density parameter by controlling the types and ratios of silane compounds and maleimide compounds used. The specific selection of silane compounds with carbon-carbon unsaturated bonds or epoxy skeletons, combined with maleimide compounds, allows achieving adequate crosslinking for high elastic modulus while maintaining appropriate moldability during manufacturing processes

The patent creates different local properties within the resin system: the silane compounds provide crosslinking zones for structural integrity and elastic modulus, while the maleimide compounds and other resin components maintain regions with appropriate flow characteristics for moldability. This spatial and functional differentiation allows simultaneous achievement of high strength and ease of manufacture