Resin Composition for Printed Wiring Boards
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Solution Overview
Problem
Existing resin compositions for printed wiring boards face challenges in achieving a balance between high heat resistance, chemical resistance, low water absorption, and electrical properties, particularly in multilayer coreless boards, where they often compromise on flow properties or fail to improve dielectric properties and flame retardance.
Innovation Solution
A resin composition combining phenolic, maleimide, epoxy, cyclic carbodiimide compounds, and an inorganic filler, with a specific content range of the inorganic filler and cyclic carbodiimide, along with a curing accelerator, to enhance heat resistance, chemical resistance, and electrical properties while maintaining flow properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a multifunctional thermosetting resin is used to improve heat resistance, then heat resistance is improved, but chemical resistance and electrical properties (low dielectric constant and low dielectric loss tangent) are insufficient
Solution Approach 1:
The patent uses a composite resin system combining phenolic resin, maleimide compound, epoxy compound, and cyclic carbodiimide compound. This composite material approach allows each component to contribute specific properties: phenolic resin provides heat resistance, while the combination of other compounds improves chemical resistance and electrical properties, resolving the contradiction between heat resistance and other performance requirements
Solution Approach 2:
The patent optimizes the content ratios of different resin components and inorganic fillers to achieve the desired balance of properties. By adjusting the parameters of composition and curing conditions, the material achieves simultaneous improvement in heat resistance, chemical resistance, and electrical properties
2Temperature
If inorganic filler content is increased to improve heat resistance and chemical resistance, then heat resistance and chemical resistance are improved, but flow properties deteriorate
Solution Approach 1:
The patent optimizes the inorganic filler content to a specific range (100-250 parts by mass based on 100 parts by mass of resin solid content) and adjusts the resin composition to maintain appropriate viscosity and gel time, achieving a balance between heat resistance improvement and flow properties
Solution Approach 2:
The use of a composite resin system with multiple organic compounds improves the resin matrix properties, allowing better dispersion and distribution of inorganic fillers, which maintains flow properties while achieving the desired heat resistance and chemical resistance
3Reliability
If resin composition is optimized for low dielectric constant and low dielectric loss tangent, then electrical properties are improved, but heat resistance and chemical resistance are insufficient
Solution Approach 1:
The patent employs a composite resin system where phenolic resin provides heat resistance, maleimide compound and epoxy compound contribute to low dielectric properties, and cyclic carbodiimide compound enhances chemical resistance. This multi-component composite allows simultaneous achievement of electrical properties, heat resistance, and chemical resistance
Data Source
AI summary
A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.