Resin Composition for Printed Circuit Boards with High Thermal Resistance
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Solution Overview
Problem
Conventional resin compositions for printed circuit boards fail to meet the demands for high thermal resistance, high dimensional stability, and good dielectric properties, particularly in 5G technology applications where materials need to withstand multiple lamination processes and assembly operations.
Innovation Solution
A resin composition comprising 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin, 20-150 parts by weight of a homopolymer with specific molecular weights, and optionally including polyolefin and crosslinking agents, which provides enhanced thermal resistance and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyphenylene ether or polyolefin is used as the main component with triallyl isocyanurate as the auxiliary crosslinking component, then dielectric properties are improved, but thermal resistance and dimensional stability are insufficient
Solution Approach 1:
The patent uses a composite resin system combining polyphenylene ether (PPE) with polyolefin and crosslinking agents to achieve both good dielectric properties and high thermal resistance. The composite formulation allows the materials to complement each other's strengths while mitigating weaknesses.
Solution Approach 2:
The patent modifies the chemical composition parameters by introducing specific crosslinking agents and adjusting the ratio of PPE to polyolefin, thereby changing the material's thermal and mechanical properties to meet the requirements for high thermal resistance and dimensional stability.
2Reliability
If polyphenylene ether or polyolefin is used as the main component with triallyl isocyanurate as the auxiliary crosslinking component, then dielectric properties are improved, but dimensional stability is insufficient
Solution Approach 1:
The patent employs a composite resin system combining polyphenylene ether (PPE) with polyolefin and crosslinking agents to achieve both good dielectric properties and high thermal resistance. The composite formulation allows the materials to complement each other's strengths while mitigating weaknesses.
Solution Approach 2:
The patent modifies the chemical composition parameters by introducing specific crosslinking agents and adjusting the ratio of PPE to polyolefin, thereby changing the material's thermal and mechanical properties to meet the requirements for high thermal resistance and dimensional stability.
3Ease of manufacture
If conventional resin materials are used, then manufacturing simplicity is maintained, but performance requirements for 5G technology are not met
Solution Approach 1:
The patent modifies the chemical composition parameters by introducing specific crosslinking agents and adjusting the ratio of PPE to polyolefin, thereby changing the material's thermal and mechanical properties to meet the requirements for high thermal resistance and dimensional stability.
Solution Approach 2:
The patent employs a composite resin system combining polyphenylene ether (PPE) with polyolefin and crosslinking agents to achieve both good dielectric properties and high thermal resistance. The composite formulation allows the materials to complement each other's strengths while mitigating weaknesses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves a glass transition temperature of at least 241°C, maintains structural integrity without delamination under thermal resistance tests, and exhibits low dissipation factor, ensuring excellent thermal stability and dielectric performance.
Implementation Method 1
a homopolymer of Formula (1), wherein R is a functional group containing an unsaturated C═C double bond
Implementation Method 2
based on 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin, comprising: 100 parts by weight of the unsaturated C═C double bond-containing polyphenylene ether resin; and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1)
Data Source
AI summary
A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.