Resin Composition for PCB Warpage Suppression
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Solution Overview
Problem
Conventional approaches to reduce thermal expansion in printed circuit boards have reached their limits, and methods to increase laminate rigidity and glass transition temperature often compromise moldability and heat resistance, failing to adequately suppress warpage in semiconductor plastic packages.
Innovation Solution
A resin composition comprising alkenyl-substituted nadimide, maleimide compound, and amino-modified silicone, with specific ratios and formulations, along with optional inorganic fillers and additional components, to maintain elastic modulus and lower thermal expansion, thereby improving moldability and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a general-purpose resin is used for filling non-conductive patterns, then ease of manufacture is improved, but manufacturing precision deteriorates due to resin leakage and poor filling of fine gaps
Solution Approach 1:
The patent modifies the chemical composition parameters of the resin by incorporating specific components (cyclic carboxylic acid anhydride, aromatic isocyanate, and polyol) to adjust viscosity and reactivity. This enables the resin to fill fine gaps effectively while preventing leakage, resolving the contradiction between ease of manufacture and manufacturing precision.
Solution Approach 2:
The patent creates a composite resin system by combining multiple chemical components with specific functional properties. The synergistic interaction between the cyclic carboxylic acid anhydride, aromatic isocyanate, and polyol produces a resin with optimized flow and curing characteristics suitable for high-precision filling applications.
2Productivity
If resin is heated to accelerate curing, then productivity is improved, but reliability deteriorates due to resin leakage from thermal expansion
Solution Approach 1:
The patent changes the chemical reactivity parameters of the resin system to enable fast curing at lower temperatures. The specific combination of cyclic carboxylic acid anhydride, aromatic isocyanate, and polyol creates a highly reactive system that cures rapidly without requiring excessive heat, thus preventing thermal expansion-induced leakage while maintaining high productivity.
3Ease of manufacture
If conventional resin systems are used, then ease of manufacture is maintained, but manufacturing precision deteriorates due to inability to fill gaps smaller than 1 µm
Solution Approach 1:
The patent optimizes the viscosity and surface tension parameters of the resin through selective component addition. The cyclic carboxylic acid anhydride, aromatic isocyanate, and polyol combination produces a resin with low viscosity and appropriate surface tension, enabling it to penetrate and fill gaps smaller than 1 µm while maintaining process simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively maintains elastic modulus and reduces thermal expansion, enhancing moldability, desmear resistance, and chemical resistance while suppressing warpage in semiconductor packages, addressing the limitations of existing technologies.
Implementation Method 1
a cyclic carboxylic acid anhydride, an aromatic isocyanate, and a polyol
Implementation Method 2
accelerating the curing of resin
Data Source
AI summary
The resin composition of the present invention comprises an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C) .