Resin Composition for PCBs with High Peel Strength
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Solution Overview
Problem
Existing resin compositions for printed circuit boards face challenges in achieving both high metal foil peel strength and desmear resistance, as high filler incorporation for thermal expansion reduction compromises peel strength and chemical resistance, particularly in alkaline desmear steps.
Innovation Solution
A resin composition comprising a prepolymer obtained by polymerizing alkenyl-substituted nadimide, maleimide compounds, and amino-modified silicone, combined with a thermosetting component and inorganic fillers like silica or alumina, which enhances both metal foil peel strength and desmear resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If high filler incorporation is used to reduce thermal expansion, then thermal expansion is reduced, but metal foil peel strength deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system by introducing amino-modified silicone compounds and controlling the ratio of maleimide to amino groups, which fundamentally alters the resin's adhesive properties and chemical resistance without relying solely on filler content
Solution Approach 2:
The patent creates a composite resin system combining multiple components (maleimide compounds, amino-modified silicone, and fillers) where the synergistic interaction between the resin matrix and fillers achieves both low thermal expansion and high peel strength through optimized composition rather than maximum filler loading
2Stability of the object's composition
If high filler incorporation is used to reduce thermal expansion, then thermal expansion is reduced, but desmear resistance deteriorates
Solution Approach 1:
The patent modifies the chemical parameters of the resin system by incorporating amino-modified silicone compounds with specific amino group content (10-100 mg KOH/g), which enhances chemical resistance to alkaline desmear solutions while maintaining low thermal expansion properties
Solution Approach 2:
The patent uses a resin system that forms a protective barrier layer during the desmear process, sacrificing the surface integrity temporarily during chemical exposure but maintaining overall structural integrity and preventing contamination
3Strength
If low filler incorporation is used to maintain peel strength, then metal foil peel strength is maintained, but thermal expansion reduction is insufficient
Solution Approach 1:
The patent changes the resin matrix composition parameters to achieve low thermal expansion through chemical formulation rather than physical filler loading, allowing maintainance of high peel strength with moderate filler content by optimizing the resin's intrinsic thermal properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively achieves high levels of metal foil peel strength and desmear resistance, maintaining excellent moldability and chemical resistance, even under alkaline conditions, thereby improving the quality and productivity of printed circuit boards.
Implementation Method 1
a prepolymer (P) being obtained by polymerizing an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C)
Implementation Method 2
reacted with (B) a polyamino compound such as methylene dianiline and (C) maleimide based compound (e.g. allylmaleimide) having ethylenic unsaturated bond or nadic imide based compound (e.g. allylnadic imide) while heating in the presence of a radical catalyst
Data Source
AI summary
The resin composition of the present invention comprises a prepolymer (P) and a thermosetting component, the prepolymer (P) being obtained by polymerizing an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).