Resin Composition for Printed Wiring Boards
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Solution Overview
Problem
Existing resin compositions for printed wiring boards lack sufficient adhesiveness between conductor layers formed by plating and insulating layers, and do not provide adequate glass transition temperature and heat resistance after moisture absorption.
Innovation Solution
A resin composition comprising an epoxy compound, a cyanate compound, a maleimide compound, an inorganic filler, and an imidazole silane, with specific formulations and ratios, to enhance adhesiveness, glass transition temperature, and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional resin compositions (epoxy resin, phenolic resin, imidazole silane) are used to improve adhesiveness between inner layer circuit and insulating layer, then adhesiveness is improved, but glass transition temperature remains insufficient
Solution Approach 1:
The patent uses a composite resin system combining epoxy resin, phenolic resin, and imidazole silane in specific proportions. This composite material approach allows the formulation to achieve both high adhesiveness (through phenolic resin and imidazole silane) and high glass transition temperature (through epoxy resin and cyanate compound), resolving the contradiction between adhesion strength and thermal stability.
Solution Approach 2:
The patent optimizes the compositional parameters of the resin system, specifically controlling the ratios of epoxy resin, phenolic resin, imidazole silane, and cyanate compound. By adjusting these parameters within defined ranges, the formulation achieves simultaneous improvement in adhesiveness and glass transition temperature, transforming the trade-off into a synergistic relationship.
2Strength
If resin composition is formulated for high adhesiveness with plating metal layer, then adhesion is improved, but heat resistance after moisture absorption deteriorates
Solution Approach 1:
The patent employs a composite resin system including epoxy resin, phenolic resin, cyanate compound, and imidazole silane. This composite formulation provides both high adhesion to plating metal layers (through imidazole silane and phenolic resin) and excellent heat resistance after moisture absorption (through the synergistic combination of all components), eliminating the trade-off between adhesion and thermal reliability.
Solution Approach 2:
The imidazole silane acts as an intermediary component that enhances the interface between the cured resin and plating metal layer, improving adhesion without compromising the bulk properties of the resin system. This intermediary function allows the formulation to achieve high adhesion while maintaining heat resistance and moisture absorption performance.
3Quantity of substance
If laminate is thinned to improve packaging density, then packaging density is improved, but packaging reliability and warpage control deteriorate
Solution Approach 1:
The patent modifies the resin composition parameters to achieve high mechanical strength and dimensional stability even in thinned laminate configurations. By optimizing the resin system to provide superior adhesion and high glass transition temperature, the formulation enables reduced laminate thickness while maintaining packaging reliability and controlling warpage, thus resolving the contradiction between density and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent adhesiveness between insulating and conductor layers, high glass transition temperature, and improved heat resistance after moisture absorption, thereby enhancing the performance of printed wiring boards.
Implementation Method 1
excellent adhesiveness between an insulating layer and a conductor layer formed on the surface of the insulating layer by plating
Implementation Method 2
high glass transition temperature
Implementation Method 3
excellent heat resistance after moisture absorption
Data Source
AI summary
A resin composition used as a material of an insulating layer of a printed wiring board including the insulating layer and a conductor layer formed on a surface of the insulating layer by plating, the resin composition including: an epoxy compound; a cyanate compound; a maleimide compound; an inorganic filler; and an imidazole silane, wherein the maleimide compound includes a predetermined maleimide compound, a content of the maleimide compound is 25% by mass or less based on 100% by mass of a total content of the epoxy compound, the cyanate compound, and the maleimide compound, and the imidazole silane includes a compound represented by the formula (3).