Resin Composition Pre-Curing for OLED Sealing
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Solution Overview
Problem
Existing resin compositions for OLED devices face challenges such as high heat degradation, poor moisture resistance, and difficult handling due to thermal curing and high tackiness, while also requiring complex lamination processes.
Innovation Solution
A resin composition comprising polyisobutylene resin, polyisoprene resin with epoxy-reactive functional groups, a tackifier resin, and an epoxy resin, which is pre-cured before the sealing step to avoid thermal curing and enhance moisture resistance and adhesion strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thermoset resin composition is used as a whole surface sealing material, then lamination work is easy and water vapor transmission of cured product is low, but OLED device is degraded by heating temperature for thermal curing
Solution Approach 1:
The patent changes the curing temperature parameter from high (thermal curing) to low (room temperature or mild heating), enabling the resin to cure without degrading the OLED device while maintaining sealing performance
Solution Approach 2:
The patent applies preliminary action by pre-curing the resin composition before lamination onto the OLED device, so that the curing process occurs before the device is exposed to heat, eliminating heat degradation risk
2Reliability
If a polyisobutylene resin and hydrogenated cyclic olefin based polymer are used as sealing film, then the film has high tackiness, but the protective film is difficult to detach and handling is extremely difficult
Solution Approach 1:
The patent adjusts the tackiness parameter by controlling the resin composition and curing degree, achieving optimal balance between adhesion and handling - the cured resin provides sufficient tackiness for sealing while maintaining ease of handling during the sealing process
3Reliability
If a composition for sealing material containing isobutylene polymer, epoxy group-containing compound, and curing agent is used, then the composition requires hot-melt application, but a sheet cannot be produced conveniently like varnish coating
Solution Approach 1:
The patent changes the application method parameter from hot-melt to varnish coating by adjusting the resin composition to allow solution-based application, enabling convenient sheet production while maintaining sealing performance through subsequent curing
Solution Approach 2:
The patent applies preliminary action by pre-curing the resin composition before sealing to eliminate the need for post-sealing thermal curing, allowing varnish coating application and convenient sheet production
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for varnish coating, reduces heat degradation, and provides superior moisture resistance and handling properties, enabling reliable sealing of OLED devices without the need for post-sealing thermal curing.
Implementation Method 1
a polyisoprene resin and/or a polyisobutylene resin, each having a functional group capable of reacting with an epoxy group
Data Source
AI summary
A resin composition containing a polyisobutylene resin, a polyisoprene resin and/or a polyisobutylene resin, each having a functional group capable of reacting with an epoxy group, a tackifier resin, and an epoxy resin.