Resin Composition for Printed Wiring Boards with Balanced Dielectric and Thermal Properties
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Solution Overview
Problem
The resin composition described in Patent Literature 1 has good thermal expansion coefficient properties but lacks balance in dielectric characteristics, glass transition temperature (Tg), and thermal conductivity.
Innovation Solution
A resin composition comprising a maleimide compound with a specific structure and a cyanate compound, along with optional additional compounds and fillers, to achieve a balance in flexural strength, dielectric characteristics, glass transition temperature, thermal expansion coefficient, and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a resin composition containing a cyanate compound having a particular structure is used, then the thermal expansion coefficient is improved, but the balance of dielectric characteristics, glass transition temperature, and thermal conductivity deteriorates
Solution Approach 1:
The patent changes the chemical structure parameters of the cyanate compound by introducing specific substituents (aryl groups, alkyl groups, or aralkyl groups) at the 2-position and 6-position of the naphthalene ring. This structural modification allows optimization of multiple properties simultaneously, achieving both low thermal expansion coefficient and good balance of dielectric characteristics, glass transition temperature, and thermal conductivity.
Solution Approach 2:
The patent creates a composite resin composition by combining the specifically structured cyanate compound with epoxy resin and optionally other components like bismaleimide compounds or nadimide compounds. This composite approach enables the material to achieve a balanced performance across multiple properties that cannot be obtained by a single compound alone.
2Ease of manufacture
If conventional resin compositions are used for printed wiring boards, then manufacturing simplicity is maintained, but the physical property balance in flexural strength, dielectric characteristics, heat resistance, thermal expansion coefficient, and thermal conductivity deteriorates
Solution Approach 1:
The patent modifies the chemical structure parameters of the cyanate compound by introducing specific substituents (aryl groups, alkyl groups, or aralkyl groups) at the 2-position and 6-position of the naphthalene ring. This structural modification allows optimization of multiple properties simultaneously, achieving both low thermal expansion coefficient and good balance of dielectric characteristics, glass transition temperature, and thermal conductivity.
Solution Approach 2:
The patent creates a composite resin composition by combining the specifically structured cyanate compound with epoxy resin and optionally other components like bismaleimide compounds or nadimide compounds. This composite approach enables the material to achieve a balanced performance across multiple properties that cannot be obtained by a single compound alone.
Data Source
AI summary
The resin composition of the present invention contains a maleimide compound (A) represented by the following formula (1); and a cyanate compound (B). wherein R each independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms, a proportion of R representing a methyl group, among all R, is 50 mol% or more, and n represents an integer of 0 to 2.