Resin Composition for Millimeter-Wave Radar PCBs
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Solution Overview
Problem
Current substrate materials for printed wiring boards in high-frequency applications lack enhanced adhesiveness to conductors, high glass transition temperature, flame retardancy, and low thermal expansion characteristics, while also requiring reduced transmission loss and high reliability, especially for millimeter-wave radar applications.
Innovation Solution
A resin composition incorporating a compound with a maleimido group, a divalent group having at least two imido bonds, and a saturated or unsaturated divalent hydrocarbon group, along with an inorganic filler and catalyst, is used to create a support, prepreg, laminate, and printed wiring board with improved high-frequency characteristics, adhesiveness, and thermal properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If polyphenylene ether-based resins are used for low transmission loss, then high-frequency characteristics are improved, but adhesiveness to conductors and flame retardancy are insufficient
Solution Approach 1:
The patent uses a composite resin system combining polyphenylene ether (PPE) with epoxy resin and cyanate ester resin. The PPE provides low dielectric loss for high-frequency performance, while the epoxy and cyanate ester components contribute to improved adhesiveness to conductors and flame retardancy, achieving a balance of multiple required properties through material composition
2Loss of energy
If polyphenylene ether-based resins are used for low transmission loss, then high-frequency characteristics are improved, but flame retardancy is insufficient
Solution Approach 1:
The resin composition combines PPE with epoxy resin and cyanate ester resin, where the epoxy and cyanate ester components provide enhanced flame retardancy through their chemical structure and combustion characteristics, while PPE maintains the low transmission loss property for high-frequency applications
3Loss of energy
If low-profile copper foil with very low surface roughness is used, then high-frequency characteristics are improved, but adhesiveness to resin deteriorates
Solution Approach 1:
The patent modifies the resin composition parameters by incorporating epoxy resin and cyanate ester resin in specific proportions with PPE, changing the chemical and physical parameters of the resin to achieve sufficient adhesiveness to smooth copper foil surfaces while maintaining low transmission loss characteristics
4Ease of manufacture
If conventional resin compositions are used, then ease of manufacture is maintained, but high glass transition temperature and heat resistance are insufficient
Solution Approach 1:
The patent employs a composite resin system where epoxy resin and cyanate ester resin contribute to elevated glass transition temperature and heat resistance through their cross-linking structures and thermal stability, while the formulation maintains manufacturability through appropriate viscosity and curing characteristics
Data Source
Figure 1(a)~1(c)
Figure 2(p)~2(r)
Figure 3(a)~3(c)
AI summary
The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.