Resin Composition for Rapid Curing and Moisture Resistance
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Solution Overview
Problem
Existing packaging materials for cells require a long-time aging step for polyurethane-based adhesives, leading to increased lead time and insufficient adhesion between resin and metal layers, as well as moisture and heat resistance issues.
Innovation Solution
A resin composition comprising urethane (meth)acrylate, (meth)acrylate with a phosphoric acid group, (meth)acryl-based silane coupling agent, and (meth)acrylate with an epoxy group is used to bond base material and metal layers, allowing for rapid curing without a long-time aging step, enhancing adhesion and moisture and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a polyurethane-based adhesive is used for bonding base material layer and metal layer, then adhesive strength can be improved through aging step, but lead time increases due to long-time aging requirement
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive from conventional polyurethane-based adhesive to a resin composition containing specific components (isocyanate group-containing compound, hydroxyl group-containing compound, and catalyst) to enable rapid curing. This parameter change allows the adhesive to achieve sufficient bonding strength without requiring long-time aging, thus reducing lead time while maintaining adhesive strength
Solution Approach 2:
The patent replaces the thermal-aging mechanism with a chemical-curing mechanism. Instead of relying on heat-induced aging over extended periods, the invention uses a catalyst-driven chemical reaction that proceeds at ambient or elevated temperatures to rapidly form crosslinked structures, achieving bond strength without prolonged aging steps
2Reliability
If packaging material is placed under moist and hot environment, then moisture and heat resistance is tested, but base material layer and metal layer peel from adhesive layer
Solution Approach 1:
The patent incorporates a catalyst system that promotes rapid crosslinking of the adhesive formulation before exposure to harsh environmental conditions. This pre-formed crosslinked network structure provides resistance to moisture and heat by creating a dense, chemically stable matrix that prevents water penetration and maintains bond integrity under humid heat conditions, cushioning against environmental degradation before it occurs
Solution Approach 2:
The patent modifies the chemical parameters of the adhesive by incorporating specific catalysts that accelerate crosslinking and enhance the density and stability of the polymer network. These parameter changes in the adhesive composition result in a cured adhesive with superior resistance to moisture and heat, preventing delamination under environmental stress conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition enables firm bonding of base material and metal layers in a short time, providing excellent moisture and heat resistance, reducing delamination risks even under moist and hot conditions.
Implementation Method 1
a resin composition comprising: (1) a urethane (meth)acrylate; (2) at least one selected from the group consisting of a (meth)acrylate having a phosphoric acid group, a (meth)acryl-based silane coupling agent, and a (meth)acrylate having an isocyanate group; and (3) a (meth)acrylate having an epoxy group
Data Source
Figure 1~2
AI summary
The present invention provides a resin composition capable of securely adhering multiple members in a short time without having to establish a long aging process. There is provided a resin composition comprising: (1) a urethane (meth)acrylate; (2) at least one selected from a group consisting of (meth)acrylates having a phosphate group, (meth)acrylic silane coupling agents, and (meth)acrylates having an isocyanate group; and (3) a (meth)acrylate having an epoxy group.