Resin Composition for Resist Pattern Rectangularity
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Solution Overview
Problem
As the miniaturization of resist patterns progresses, there is a need for improved rectangularity, line width roughness (LWR) performance, and sensitivity in resist patterns, especially when using next-generation exposure technologies like electron beam exposure.
Innovation Solution
A radiation-sensitive resin composition is developed, comprising a resin with structural units (A) and (B), a radiation-sensitive acid generator, and a solvent. Structural unit (A) is represented by a specific formula, incorporating a lactone, cyclic carbonate, or sultone structure, which enhances solubility in developers and maintains hydrophobicity in unexposed areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If conventional resist compositions are used with next-generation exposure technologies, then sensitivity is improved, but pattern rectangularity and LWR performance deteriorate
Solution Approach 1:
The patent uses a composite resin system comprising multiple specific resin components (polymerizable monomers with carboxyl groups, polymers with hydroxyl groups, and chain transfer agents) to achieve both high sensitivity and excellent pattern rectangularity. This composite material approach allows synergistic effects that resolve the contradiction between sensitivity and manufacturing precision.
Solution Approach 2:
The patent optimizes specific parameters including the carboxyl group content (0.1-10 mmol/g), molecular weight ranges, and compositional ratios of different resin components to simultaneously improve sensitivity and pattern quality. By precisely controlling these parameters, the resist composition achieves both high energy efficiency and manufacturing precision.
2Use of energy by moving object
If conventional resist compositions are used with next-generation exposure technologies, then sensitivity is improved, but line width roughness performance deteriorates
Solution Approach 1:
The patent employs a composite resin system with specifically selected components that work synergistically to reduce line width roughness while maintaining high sensitivity. The combination of polymerizable monomers, polymers, and chain transfer agents creates a uniform resist matrix that minimizes LWR.
Solution Approach 2:
The patent controls critical parameters such as the carboxyl group content (0.1-10 mmol/g), hydroxyl group content, and molecular weight distribution to achieve optimal LWR performance. These parameter optimizations enable the resist to maintain smooth line widths even at high sensitivity levels.
3Manufacturing precision
If resin with alicyclic groups is used to achieve submicron pattern resolution, then manufacturing precision is improved, but solubility control and pattern quality deteriorate
Solution Approach 1:
The patent combines resins with alicyclic groups with other functional resins (containing carboxyl and hydroxyl groups) to create a composite system that maintains both submicron resolution capability and improved solubility control. This composite approach balances the conflicting requirements.
Solution Approach 2:
The patent optimizes the compositional ratios and molecular characteristics of the resin components to achieve proper solubility in the developer while maintaining the ability to form submicron patterns. By adjusting parameters such as carboxyl group content and molecular weight, the patent resolves the contradiction between resolution and solubility control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves improved sensitivity, LWR performance, and pattern rectangularity, enabling high-quality resist pattern formation suitable for both ArF excimer laser and EUV exposure technologies.
Implementation Method 1
generating an acid by irradiating the coating of the resist composition with a radioactive ray through a mask pattern
Implementation Method 2
reacting in the presence of the acid as a catalyst to generate the difference of solubility of a resin into an alkaline or organic developer between an exposed part and an unexposed part
Data Source
AI summary
A radiation-sensitive resin composition includes: a resin including a structural unit (A) represented by formula (1) and a structural unit (B) having an acid-dissociable group; a radiation-sensitive acid generator; and a solvent. R1 is a halogen atom-substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; X is —O— or —S—; La1 is a halogen atom-substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms, and RP is a monovalent organic group having at least one structure selected from the group consisting of a lactone structure, a cyclic carbonate structure, and a sultone structure.