Resin Composition for Power Semiconductor Adhesive Sheets
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Solution Overview
Problem
Adhesive sheets used in manufacturing power semiconductor devices require higher heat resistance and adhesiveness than typical resin compositions and laminates to ensure effective performance.
Innovation Solution
A resin composition comprising a thermoplastic component, a thermosetting component, and an inorganic filler, specifically including a phenoxy resin, bismaleimide resin, allyl resin, and silica filler, which provides a 5%-weight-reduction temperature of 440 degrees C. or more, enhancing heat resistance and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If typical resin composition is used, then ease of manufacture is maintained, but heat resistance and adhesiveness are insufficient for power semiconductor devices
Solution Approach 1:
The patent employs a composite resin composition containing multiple specific components: a thermoplastic resin (polycarbonate or polyphenylene oxide), a thermosetting resin (epoxy resin), and a cyanate resin. This multi-component composite system achieves the required heat resistance (Td5≥440°C) and adhesiveness for power semiconductor devices while maintaining manufacturability through established composite material processing techniques.
Solution Approach 2:
The patent specifies precise parameter ranges for the resin composition, including Td5 (5% weight reduction temperature) of 440°C or higher, and controlled ratios of thermoplastic resin (1-50 parts by mass), thermosetting resin (1-40 parts by mass), and cyanate resin (1-20 parts by mass) relative to the thermoplastic resin. These parameter optimizations enable the composition to meet high-performance requirements while remaining manufacturable.
2Reliability
If higher heat resistance is achieved through resin composition modification, then reliability improves, but manufacturing precision may be affected
Solution Approach 1:
The patent optimizes the thermal stability parameter Td5 to be 440°C or higher through specific resin selection and配比, while controlling the composition ratios to ensure proper processing behavior. The cyanate resin component (1-20 parts by mass) specifically contributes to both heat resistance and processing characteristics, enabling high-temperature stability without compromising manufacturing precision.
Solution Approach 2:
The patent assigns specific functional roles to different resin components: the thermoplastic resin provides base structural integrity, the thermosetting resin enhances adhesion and thermal stability, and the cyanate resin specifically improves heat resistance and processing properties. This functional differentiation allows each component to optimize its local contribution to overall performance and manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition and sheet exhibit improved heat resistance and adhesiveness, suitable for power semiconductor devices, particularly those using silicon carbide or gallium nitride, offering superior bonding strength and thermal stability.
Implementation Method 1
a 5%-weight-reduction temperature of a hardened substance of the resin composition is 440 degrees C. or more
Data Source
AI summary
A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.