Resin Composition for Semiconductor Packages with Low Thermal Expansion
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Solution Overview
Problem
The challenge is to develop a resin composition for semiconductor packages that balances low thermal expansion, high flowability, and excellent adhesive strength for metal foils while maintaining low permittivity and dissipation factor, especially when packed with a high content of inorganic fillers, which existing technologies struggle to achieve due to reduced rigidity and warpage issues in slimmed-down semiconductor packages.
Innovation Solution
A resin composition comprising a modified phenylene ether oligomer, ethylenically unsaturated groups, polybutadiene, styrene-butadiene copolymer, bismaleimide resin, cyanate ester resin, quinone compound, alkoxysilane oligomer, and inorganic filler, which allows for controlled radical polymerization and improved flowability and adhesive strength, integrated with a prepreg and metal clad laminate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the prepreg is packed with a high content of inorganic filler to reduce the coefficient of thermal expansion, then the thermal expansion is reduced, but the flowability of the prepreg is drastically reduced
Solution Approach 1:
The invention uses a composite resin system combining modified phenylene ether oligomer with polybutadiene, styrene-butadiene copolymer, bismaleimide resin, and cyanate ester resin. This multi-component composite approach allows the resin to maintain low thermal expansion (matching the inorganic filler) while the elastomeric components (polybutadiene, SBR) provide the necessary flowability and flexibility that single-resin systems cannot achieve with high filler loads.
Solution Approach 2:
The invention changes the chemical and physical parameters of the resin system by incorporating elastomeric components (polybutadiene with 1,2-vinyl groups, styrene-butadiene copolymer) that modify the flow characteristics. These parameter changes enable the resin to flow properly around inorganic fillers while maintaining the low thermal expansion coefficient required for semiconductor applications.
2Volume of moving object
If the semiconductor package is slimmed down to achieve slimness, then the size is reduced, but the rigidity of the printed circuit board is reduced and warpage phenomenon increases
Solution Approach 1:
The invention creates a composite material system where inorganic fillers (providing rigidity and low thermal expansion) are embedded in a specially formulated resin matrix (providing flexibility and flowability). This composite structure allows thin packages to maintain sufficient rigidity while the elastomeric resin components prevent warpage by accommodating thermal stress.
Solution Approach 2:
The invention directly addresses thermal expansion by formulating a resin system with a coefficient of thermal expansion that matches the inorganic fillers and semiconductor chips. This thermal expansion matching prevents warpage during temperature cycling, allowing slim packages to maintain structural integrity without the warpage issues that typically plague thin designs.
3Stability of the object's composition
If a high content of inorganic filler is used to reduce thermal expansion, then the thermal expansion coefficient is reduced, but the adhesive strength for metal foil deteriorates
Solution Approach 1:
The invention uses a composite resin system where the elastomeric components (polybutadiene, styrene-butadiene copolymer) provide adhesion promoters that bond to both the inorganic filler surfaces and the metal foil. This composite approach allows high filler content (for low thermal expansion) while the resin matrix maintains excellent adhesive properties that single-resin systems cannot achieve.
Solution Approach 2:
The resin system acts as an intermediary between the inorganic filler and metal foil, with the elastomeric components providing bonding interfaces. The modified phenylene ether oligomer and elastomeric resins create chemical and physical bonds that transfer stress effectively, maintaining adhesive strength even with high filler loads that would otherwise interfere with metal foil bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a prepreg and metal clad laminate with low thermal expansion, high flowability, and excellent adhesive strength for metal foils, maintaining low permittivity and dissipation factor, effectively addressing the warpage and rigidity issues in semiconductor packages.
Implementation Method 1
controlled radical polymerization
Implementation Method 2
alkoxysilane oligomer
Implementation Method 3
alkoxysilane oligomer
Implementation Method 4
coefficient of thermal expansion
Data Source
AI summary
A resin composition, optionally for a semiconductor package, and a prepreg and a metal clad laminate using the same are provided. The resin composition according to the present invention may exhibit excellent flowability although being packed with a high content of an inorganic filler, and may provide a prepreg and a metal clad laminate having excellent adhesive strength for a metal foil, and low relative permittivity and a low dissipation factor.