Resin Composition for Semiconductor Packages
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Solution Overview
Problem
Conventional thermosetting resin compositions used in semiconductor packages often experience minute peeling at interfaces and lack sufficient heat resistance, which affects power cycling capability and mechanical strength, especially with the increasing demand for high-temperature resistance in next-generation power semiconductors.
Innovation Solution
A resin composition is developed by incorporating a thermoplastic resin powder, such as powdered polyetherimide, polybenzimidazole, or polyamide-imide, along with an inorganic filler and an acid anhydride-based curing agent, to enhance mechanical strength, heat resistance, and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional thermosetting resin composition is used as a sealant, then the sealant provides basic sealing function, but minute peeling occurs at the interface between the sealant and multiple members, causing deterioration of power cycling capability
Solution Approach 1:
The patent applies composite materials by combining thermosetting resin (epoxy resin) with thermoplastic resin particles (polyetherimide, polybenzimidazole, polyamide-imide, etc.) and inorganic fillers to create a hybrid resin composition. This composite structure provides both the adhesion and sealing properties of thermosetting resin and the flexibility, heat resistance, and impact resistance of thermoplastic resin, preventing interface peeling and improving power cycling capability.
Solution Approach 2:
The patent changes the physical and chemical parameters of the sealant by controlling the particle size distribution of thermoplastic resin particles (0.1-10 μm), the ratio of thermoplastic to thermosetting resin (5-50 parts by mass per 100 parts thermosetting resin), and the composition of inorganic fillers. These parameter optimizations enhance adhesion strength and eliminate interface peeling while maintaining sealing performance.
2Temperature
If a conventional thermosetting resin composition is used, then the sealant provides basic mechanical properties, but heat resistance is insufficient for next generation power semiconductors operating at high temperatures
Solution Approach 1:
The patent incorporates high-temperature resistant thermoplastic resin particles (polyetherimide with Tg of 217°C, polybenzimidazole with Tg of 427°C, polyamide-imide with Tg of 280°C) into the thermosetting resin matrix. This composite structure raises the overall heat resistance of the sealant, enabling it to maintain dimensional stability and mechanical properties at elevated temperatures required for next generation power semiconductors.
Solution Approach 2:
The patent optimizes the glass transition temperature (Tg) of the cured resin product to be 170°C or higher by selecting appropriate thermoplastic resin types and controlling their content (1-50 parts by mass per 100 parts thermosetting base resin). This parameter control ensures the sealant maintains its structural integrity and sealing performance under high-temperature operating conditions.
3Strength
If the resin composition includes thermoplastic resin powder to enhance mechanical strength and heat resistance, then the cured resin product achieves improved properties, but the composition complexity increases
Solution Approach 1:
The patent creates a multi-component composite resin system comprising thermosetting base resin, thermoplastic resin particles, inorganic fillers, and curing agents. This composite approach systematically combines materials with complementary properties to achieve superior mechanical strength, heat resistance, and adhesion, while the defined composition ranges (1-50 parts thermoplastic per 100 parts thermosetting resin, 0.1-10 μm particle size) simplify manufacturing control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent mechanical strength, heat resistance, and moisture resistance, improving the reliability of electronic components, particularly in outdoor applications where environmental management is challenging.
Implementation Method 1
a resin composition including a thermosetting base resin, a thermoplastic resin powder, a curing agent, and an inorganic filler
Implementation Method 2
An inorganic filler added to the thermosetting resin decreases the coefficient of thermal expansion of the thermosetting resin, suppresses the warping of a cured resin product
Implementation Method 3
a resin composition including a thermosetting base resin, a thermoplastic resin powder, a curing agent, and an inorganic filler
Data Source
AI summary
A resin composition has a high glass transition temperature and is highly adhesive to a member made of metal, ceramics, or the like. The resin composition includes a thermosetting base resin, a thermoplastic resin powder, a curing agent, and an inorganic filler, a cured resin product formed by curing the resin composition, and an electrical member.