Resin Composition for Semiconductor Packages with Low Thermal Expansion
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Solution Overview
Problem
Conventional semiconductor packages face challenges with warpage due to thermal expansion differences between chips and printed circuit boards, and existing prepregs with high filler content suffer from reduced flow properties and miscibility issues during the reflow process.
Innovation Solution
A resin composition for semiconductor packages incorporating an amine curing agent with specific functional groups and a combination of inorganic fillers with varying particle sizes, which controls curing reactions and enhances miscibility and mechanical properties, while maintaining low thermal expansion characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the printed circuit board is thinned to reduce semiconductor package thickness, then the thickness of the semiconductor package is reduced, but the stiffness of the printed circuit board is decreased and warpage occurs due to thermal expansion differences
Solution Approach 1:
The patent changes the thermal expansion parameters of the resin composition by controlling the particle size distribution of inorganic fillers (combining fine particles of 0.1-10 μm with ultra-fine particles of 1-90 nm) to achieve low thermal expansion characteristics that compensate for the reduced structural stiffness in thinned boards
Solution Approach 2:
The patent uses a composite material system consisting of thermosetting resin combined with a specific mixture of inorganic fillers having different particle sizes, creating a material with optimized mechanical properties and low thermal expansion to maintain stiffness in thinned semiconductor packages
2Temperature
If high filler content is added to prepreg to lower thermal expansion rate, then the thermal expansion rate is reduced, but the flow property of the prepreg is lowered
Solution Approach 1:
The patent segments the filler particles into two distinct size ranges (0.1-10 μm and 1-90 nm) that work synergistically, where the fine particles provide thermal expansion control while the ultra-fine particles fill voids and maintain resin flowability, allowing high filler content without sacrificing flow properties
Solution Approach 2:
The patent applies local quality by using ultra-fine particles (1-90 nm) specifically to fill interstitial spaces between larger filler particles and resin molecules, locally improving packing efficiency and maintaining flow properties while the overall high filler content achieves low thermal expansion
3Temperature
If high filler content is added to prepreg to lower thermal expansion rate, then the thermal expansion rate is reduced, but the miscibility between filler and resin is limited
Solution Approach 1:
The patent changes the surface parameters of inorganic fillers through surface treatment with silane coupling agents, modifying surface energy and chemical composition to enhance compatibility and miscibility with the thermosetting resin matrix, allowing stable dispersion of high filler content
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition ensures high miscibility, low thermal expansion, and excellent mechanical properties, minimizing warpage and improving the reliability and flow properties of prepregs and metal clad laminates during the reflow process.
Implementation Method 1
an amine curing agent containing one or more functional groups selected from the group consisting of a sulfone group, a carbonyl group, a halogen group, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, a heteroaryl group having 2 to 20 carbon atoms, and an alkylene group having 1 to 20 carbon atoms; a thermosetting resin
Implementation Method 2
an inorganic filler containing a first inorganic filler having an average particle diameter of 0.1 μm to 100 μm and a second inorganic filler having an average particle diameter of 1 nm to 90 nm
Data Source
AI summary
The present invention relates to a resin composition having high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.