Resin Composition for Semiconductor High-Temperature Pattern Integrity

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Solution Overview

Problem

Existing resin compositions for semiconductor manufacturing face challenges in maintaining high resolution and pattern integrity during high-temperature processing, and are either difficult to peel off or result in insufficient resolution and heat resistance.

Innovation Solution

A resin composition comprising an alkali-soluble resin with specific structural units, combined with polyimides, polybenzoxazoles, or polyamideimides, and a photosensitizer, which allows for high resolution and heat resistance while being soluble in alkaline solutions for easy peeling after processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If polyimide-based photosensitive composition is used for high temperature processing, then heat resistance is improved, but pattern reflow and curing shrinkage occur at 150°C or higher causing loss of resolution and rectangular pattern formation

Engineering Contradiction:

Improveheat resistanceVSAvoidresolution

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent uses a composite resin composition combining polyimide resin (providing heat resistance) with specific additives and molecular structures that prevent pattern reflow and curing shrinkage. The composition includes polyimide resin, a compound with specific molecular structure (Formula 1), and a crosslinking agent, creating a composite material that maintains both heat resistance and pattern integrity at high temperatures.

Inventive Principle:

Principle #40Composite materials

2Temperature

If polyimide layer is used for high temperature processing, then heat resistance is improved, but the film becomes difficult to peel requiring complicated lift-off processes

Engineering Contradiction:

Improveheat resistanceVSAvoidpeeling process

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent extracts the peeling function from the polyimide layer by incorporating a specific compound (Formula 1) that enables controlled dissolution. This compound contains functional groups that allow the cured film to be selectively removed using alkaline solutions or specific solvents, enabling easy peeling without requiring additional lift-off layers or complicated processes.

Inventive Principle:

Principle #2Taking out (Extraction)

3Ease of manufacture

If conventional photoresist is used, then easy peeling is achieved, but heat resistance and cracking resistance are insufficient for ion implantation processes

Engineering Contradiction:

Improvepeeling easeVSAvoidheat resistance

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent creates a composite material system where polyimide resin provides the heat resistance and cracking resistance needed for ion implantation, while the added compound (Formula 1) and crosslinking agents maintain pattern integrity and enable controlled peeling. This composite approach allows the resin to withstand high-temperature ion implantation processes while remaining removable after use.

Inventive Principle:

Principle #40Composite materials

4Manufacturing precision

If resin composition is designed for high resolution, then pattern integrity is improved, but heat resistance and cracking resistance during ion implantation are insufficient

Engineering Contradiction:

Improvepattern integrityVSAvoidheat resistance

Core Design Contradiction:

Manufacturing precisionVSTemperature

Solution Approach 1:

The patent combines polyimide resin (providing heat resistance) with a crosslinking agent and compound of Formula 1 (maintaining pattern integrity) to create a composite that simultaneously achieves high resolution and heat resistance. The crosslinking structure prevents cracking during ion implantation while the polyimide base maintains pattern definition.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resin composition maintains high resolution and pattern integrity even after high-temperature processing, is easily removable, and provides improved heat resistance, making it suitable for advanced semiconductor manufacturing processes.

Implementation Method 1

a resist film formed on a semiconductor substrate is irradiated with an active chemical ray through a mask or a reticle having a desired pattern, then developed with a developing solution, and then heated to be cured

Methodology Applied

Scientific EffectPhotochemical reaction: Photopolymerisation

Implementation Method 2

an alkali-soluble resin having a structural unit represented by general formula (1)... the resin having a substituent that reacts with a reactive group of the alkali-soluble resin

Methodology Applied

Scientific EffectAlkali dissolution: Solvation

Data Source

PatentUS10451969B2Resin composition, method for manufacturing semiconductor element using the same, and semiconductor device

Publication Date: 2019.10.22 TORAY INDUSTRIES INC

AI summary

Provided is a resin composition including: (A1) an alkali-soluble resin having a specific structural unit; (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, in which the amount of the resin (A2) is 310 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1).