Resin Composition for Low Thermal Expansion in SiP Technology
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Solution Overview
Problem
Conventional materials used in system-in-package (SiP) technology face challenges with dimensional changes and deformation due to thermal expansion, requiring materials with low dimensional change and deformation under heat.
Innovation Solution
A resin composition comprising 60 parts by weight of a maleimide resin, 10 to 30 parts by weight of an epoxy resin of Formula (I), and 2 to 40 parts by weight of methylenebis(diethylaniline), which is used to create articles such as prepregs, resin films, laminates, or printed circuit boards with specific properties like high glass transition temperature, low thermal expansion, and improved mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional materials are used in SiP technology, then the components can be integrated in one package, but dimensional change and deformation occur due to thermal expansion
Solution Approach 1:
The patent modifies the chemical composition parameters of the resin system by incorporating specific ratios of epoxy resin, maleimide resin, and amine curing agent. This chemical parameter change results in altered physical properties including reduced thermal expansion coefficient and improved dimensional stability, directly resolving the contradiction between integration capability and dimensional precision
Solution Approach 2:
The patent creates a composite resin system combining multiple resin types (epoxy, maleimide) and curing agents in specific proportions. This composite material approach leverages the complementary properties of each component to achieve both the versatility needed for SiP integration and the dimensional stability required to prevent thermal expansion deformation
2Power
If heat dissipation is increased to achieve high performance, then component performance improves, but thermal expansion and deformation increase
Solution Approach 1:
The patent converts the harmful effect of heat (thermal expansion) into a beneficial outcome by formulating a resin system that can withstand and dissipate thermal energy without deforming. The specific resin composition absorbs and manages thermal stress, allowing high power operation while maintaining dimensional stability, thus turning the heat problem into a demonstrated strength of the material
3Temperature
If glass transition temperature is increased to improve heat resistance, then thermal stability improves, but manufacturing complexity increases
Solution Approach 1:
The patent achieves high glass transition temperature by carefully adjusting the chemical composition parameters - specifically the ratios of epoxy resin, maleimide resin, and amine curing agent. This parameter optimization raises the glass transition temperature for enhanced thermal stability while maintaining a relatively simple two-component curing process, avoiding excessive manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves properties such as a glass transition temperature greater than 260°C, low storage modulus change, minimal thermal expansion, and high copper foil peeling strength, addressing the thermal and mechanical challenges in SiP technology.
Implementation Method 1
a resin composition, comprising: 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I); and 2 parts by weight to 40 parts by weight of a methylenebis(diethylaniline)
Implementation Method 2
printed circuit boards used for the SiP technology require materials with low dimensional change and low deformation under heat
Data Source
AI summary
A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.