Resin composition suitable for rigid-flex board and use thereof
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Solution Overview
Problem
Conventional resin compositions for prepregs used in rigid-flex boards fail to achieve low resin flow, high peel strength, low dust weight loss, and low moisture absorption, which are essential for efficient signal transmission and structural integrity in electronic products.
Innovation Solution
A resin composition comprising epoxy resin, high molecular weight polyetheramine, and amine-terminated acrylonitrile rubber, with specific ratios and optional additives, is developed to achieve low resin flow, high peel strength, and low moisture absorption, enhancing the properties of prepregs and laminates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional resin compositions are used for prepregs, then low resin flow can be achieved, but dust weight loss increases and peel strength at high temperature decreases
Solution Approach 1:
The patent modifies the chemical composition parameters of the resin system by incorporating specific rubber modifiers (nitrile rubber, butadiene rubber, or acrylonitrile-butadiene-styrene copolymer) at controlled ratios (1-10 parts by weight per 100 parts epoxy resin). This parameter change transforms the resin's physical and chemical properties to simultaneously achieve low flow, low dust loss, and high peel strength at elevated temperatures.
Solution Approach 2:
The invention creates a composite resin system by combining epoxy resin with rubber modifiers and curing agents. This composite material approach integrates the benefits of different components: epoxy provides structural integrity, rubber modifiers reduce flow and dust loss while enhancing adhesion, and curing agents enable crosslinking for high-temperature performance. The synergistic combination resolves the contradiction between low flow and high peel strength.
2Volume of moving object
If low-flow prepreg is used to connect rigid and flexible boards, then connector space is saved, but dust loss during processing increases
Solution Approach 1:
The patent adjusts the resin composition parameters to include rubber modifiers at specific concentrations (1-10 parts per 100 parts epoxy), which fundamentally changes the resin's rheological and mechanical properties. This parameter optimization enables the prepreg to maintain low flow for compact connector design while simultaneously reducing dust weight loss to 0.5% or less during processing.
Solution Approach 2:
The composite resin system combining epoxy, rubber modifiers, and curing agents creates a material that exhibits both low flow characteristics and low dust generation. The rubber phase acts as a binder that reduces particle detachment during handling, while the overall composite structure maintains the low-flow property needed for space-efficient connector design.
3Ease of manufacture
If conventional resin composition is used, then processing is simplified, but moisture absorption rate increases
Solution Approach 1:
The patent modifies the resin composition by incorporating rubber modifiers and optimizing curing agent ratios, which changes the crosslinking density and hydrophobicity of the cured material. This parameter change reduces the resin's affinity for moisture while maintaining ease of processing during manufacturing.
Solution Approach 2:
The composite resin system with rubber modifiers creates a more hydrophobic material structure that resists moisture absorption. The rubber phase and crosslinked network work together to reduce moisture uptake, while the formulation remains compatible with standard processing methods.
4Reliability
If high molecular weight polyetheramine and amine-terminated acrylonitrile rubber are added to epoxy resin, then peel strength and dust loss control are improved, but resin flow may increase
Solution Approach 1:
The patent carefully balances the ratios of high molecular weight polyetheramine (10-50 parts per 100 parts epoxy) and amine-terminated acrylonitrile rubber (1-10 parts per 100 parts epoxy) to optimize the competing properties. This precise parameter control ensures that the peel strength and dust loss improvement from these additives does not come at the expense of excessive resin flow.
Solution Approach 2:
The invention applies different functional components at optimized local concentrations within the resin system. The polyetheramine provides crosslinking for strength, while the amine-terminated rubber provides adhesion and dust control, with each component positioned at the optimal concentration to achieve its function without causing excessive flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively reduces resin flow, minimizes dust weight loss, and maintains high peel strength at both room and high temperatures, while controlling moisture absorption, thereby improving the yield and reliability of rigid-flex boards and laminates.
Implementation Method 1
high peel strength between the copper foil and the insulation layer of a laminate at high temperature
Implementation Method 2
low resin flow property, such as having a resin flow of less than or equal to 60 mil
Implementation Method 3
comprising an epoxy resin, a high molecular weight polyetheramine, and an amine-terminated acrylonitrile rubber
Data Source
AI summary
The disclosure relates to a resin composition, comprising an epoxy resin, a high molecular weight polyetheramine and an amine-terminated acrylonitrile rubber. Various products can be made from the resin composition, such as prepregs, laminates, printed circuit boards or rigid-flex boards, in which one, multiple or all of the following properties can be met: low resin flow, low dust weight loss, high peel strength at room temperature and at high temperature, low moisture absorption rate, and better varnish stability.