Resin Composition Thermal Conductivity Bondability
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Solution Overview
Problem
Current resin compositions for electronic and electronic instruments face challenges in achieving high thermal conductivity, bondability, and low-temperature processability, particularly in forming semi-cured thermally conductive films for circuit boards, and they often compromise on electrical insulation and weight due to high filler content.
Innovation Solution
A resin composition combining a compound with two or more epoxy groups, a curing agent, a liquid crystal polymer that forms a liquid crystal phase at 190°C or lower, and a thermally conductive filler, along with a thermoplastic resin, elastomer, and inorganic filler, to create a synergistic effect enhancing thermal conductivity and bondability while maintaining low-temperature processability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large amount of highly-thermal conductive inorganic material is blended in thermoplastic resin to achieve high thermal conductivity, then thermal conductivity is improved, but electric insulating property is impaired and weight increases
Solution Approach 1:
The patent uses a composite material system consisting of thermoplastic resin, elastomer, and inorganic filler in specific proportions. This composite structure allows the resin matrix to provide electrical insulation while the inorganic filler provides thermal conductivity, resolving the contradiction between thermal performance and electrical insulation.
Solution Approach 2:
The patent optimizes the composition parameters by controlling the resin content at 40-80 mass%, elastomer content at 5-60 mass%, and inorganic filler content at 10-50 mass%. By adjusting these parameters within specific ranges, the patent achieves both high thermal conductivity and maintained electrical insulation properties.
2Temperature
If a large amount of highly-thermal conductive inorganic material is blended in thermoplastic resin to achieve high thermal conductivity, then thermal conductivity is improved, but weight increases
Solution Approach 1:
The patent controls the inorganic filler content within 10-50 mass% rather than using excessive amounts, and selects specific inorganic materials with appropriate densities. This parameter optimization achieves high thermal conductivity while controlling weight increase.
3Reliability
If epoxy resin is used as a thermal interface material to achieve excellent heat resistance and moisture resistance, then reliability is improved, but thermal conductivity remains low
Solution Approach 1:
The patent creates a composite material where thermoplastic resin provides the base matrix with good adhesion and flexibility, elastomer enhances bondability and shock resistance, and inorganic filler provides thermal conductivity. This composite structure overcomes the low thermal conductivity limitation of pure epoxy resin while maintaining reliability.
Solution Approach 2:
The patent distributes inorganic filler particles with high thermal conductivity throughout the resin matrix, creating local thermal conduction pathways. This local quality enhancement allows heat to be efficiently conducted through specific regions while the overall material maintains good adhesion and flexibility.
4Temperature
If inorganic filler like alumina is blended in large amount to achieve high thermal conductivity, then thermal conductivity is improved, but mold wear is caused due to high hardness
Solution Approach 1:
The patent optimizes the inorganic filler content to 10-50 mass% rather than using excessive amounts, and selects inorganic materials with varying hardness levels. This parameter control reduces the overall hardness of the composite while maintaining adequate thermal conductivity, thereby reducing mold wear.
Solution Approach 2:
The patent uses a composite structure where softer thermoplastic resin and elastomer matrix surround and protect the hard inorganic filler particles. This composite architecture reduces the direct contact between hard filler and mold surfaces, minimizing wear while preserving thermal conductivity benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent thermal conductivity, flexibility, and bonding strength, enabling effective heat dissipation and transfer while maintaining electrical insulation and reducing weight, suitable for electronic circuit boards and other applications.
Implementation Method 1
a liquid crystal polymer that forms a liquid crystal phase at 190°C or lower
Implementation Method 2
forms a liquid crystal phase at 190°C or lower
Implementation Method 3
a resin composition which contains a thermally conductive organic additive, has excellent thermal conductivity
Implementation Method 4
a compound with two or more epoxy groups, a curing agent
Data Source
AI summary
To provide a resin composition having excellent thermal conductivity. Especially, to provide: a liquid crystal polymer composition which is suitable for the formation of a semi-cured thermally conductive film that has excellent thermal conductivity, bondability and low-temperature processability; and a circuit board which uses this liquid crystal polymer composition. Additionally, to provide a curable resin composition which has bonding strength in addition to high thermal conductivity. A resin composition which contains (á) a curable compound, (â) a curing agent, (ã) a liquid crystal polymer that forms a liquid crystal phase at 190°C or less, and (ä) a filler. Specifically, the above-described resin composition which is a liquid crystal polymer composition containing (I) a compound having two or more epoxy groups in each molecule, (II) a curing agent, (III) a fine powder of a liquid crystal polymer that forms an anisotropic melt form at 190°C or less, (IV) a heat transfer filler and (V) a solvent. In addition, the above-described resin composition which is a curable resin composition composed of the following components (A), (B), (C), (D) and (E): (A) a thermoplastic resin having a specific structure; (B) a curable resin; (C) a curing agent; (D) an elastomer; and (E) an inorganic filler.