Resin Composition for Low Thermal Expansion and Moldability
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Solution Overview
Problem
Current resin compositions for printed wiring boards face challenges in achieving low coefficient of thermal expansion, excellent heat resistance, and flame retardance while maintaining moldability, as existing methods either compromise on moldability or fail to meet the desired thermal expansion requirements.
Innovation Solution
A resin composition containing a specific ratio of cyanate ester compound, maleimide compound, epoxy resin, silicone rubber powder, and inorganic filler, where the silicone rubber powder and inorganic filler are present in specific amounts to achieve a low coefficient of thermal expansion, heat resistance, and flame retardance, while maintaining moldability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a large amount of inorganic filler is added to reduce the coefficient of thermal expansion, then the coefficient of thermal expansion is reduced, but the moldability of the laminate is lowered
Solution Approach 1:
The patent uses a composite resin system combining cyanate ester, maleimide compound, and epoxy resin with controlled filler content. This composite approach achieves low thermal expansion (5 ppm/°C or less) while maintaining moldability by optimizing the interaction between the specific resin matrix and inorganic filler, rather than simply increasing filler quantity.
Solution Approach 2:
The patent changes the chemical composition parameters of the resin system by specifying precise ratios of cyanate ester compound (A), maleimide compound (B), and epoxy resin (C). This parameter optimization allows the resin to accommodate inorganic filler at lower total content (10-50 wt%) while still achieving the desired thermal expansion reduction without compromising moldability.
2Manufacturing precision
If organic filler with rubber elasticity is incorporated to reduce thermal expansion, then the coefficient of thermal expansion is reduced, but the flame retardance is lowered
Solution Approach 1:
The patent extracts the flame-retardant function from the organic filler and replaces it with inorganic filler that provides thermal expansion control without compromising flame retardance. The inorganic filler (10-50 wt%) achieves the thermal expansion reduction (to 5 ppm/°C or less) without the harmful effect of reduced flame retardance associated with organic fillers.
3Object-affected harmful factors
If silicone rubber powder is used instead of organic filler to improve flame retardance, then flame retardance is improved, but the coefficient of thermal expansion is not sufficiently reduced
Solution Approach 1:
The patent merges silicone rubber powder with inorganic filler in a specific combination within the resin system. The silicone rubber powder (5-20 wt%) provides flame retardance and flexibility, while the inorganic filler (10-50 wt%) provides thermal expansion control. This merged approach achieves both low thermal expansion (5 ppm/°C or less) and good flame retardance simultaneously.
Data Source
AI summary
A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.