Resin Composition with Iron-Modified Fillers for Thermal Conductivity
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Solution Overview
Problem
Circuit boards and IC substrates face challenges with low thermal conductivity due to non-thermally conductive resin between thermally conductive powders, limiting the thermal conductivity of dielectric layers in copper foil substrates.
Innovation Solution
A resin composition comprising thermally conductive resin with a biphenyl group, polyphenylene oxide, a hardener, and inorganic fillers like boron nitride or aluminum nitride, aligned and cured to form a prepreg and copper clad laminate, enhancing thermal conductivity and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large amount of thermally conductive powder is added to the dielectric layer, then the thermal conductivity of the dielectric layer increases, but the resin between the thermally conductive powder is not thermally conductive, such that the thermally conductive effect is limited
Solution Approach 1:
The patent changes the thermal conductivity parameter of the resin by incorporating thermally conductive fillers (such as aluminum oxide, aluminum nitride, boron nitride) into the resin matrix. This transforms the resin from a thermally insulating material to a thermally conductive composite material, enabling the resin itself to conduct heat effectively and work synergistically with the thermally conductive powder particles.
Solution Approach 2:
The patent creates a composite resin system by combining the base resin with thermally conductive filler particles. This composite material approach allows the resin to maintain its dielectric properties while gaining thermal conductivity, solving the problem of heat transfer limitation in the resin matrix between thermally conductive powder particles.
2Temperature
If thermally conductive powder is dispersed in non-thermally conductive resin, then the dielectric layer can be formed, but the overall thermal conductivity remains limited due to the non-thermally conductive resin matrix
Solution Approach 1:
The patent modifies the thermal conductivity parameter of the resin matrix by adding thermally conductive fillers, transforming it from a thermal barrier to a thermal conduit. This enables efficient heat transfer through the resin matrix, improving the overall thermal conduction efficiency of the dielectric layer.
Solution Approach 2:
The thermally conductive filler particles in the resin act as intermediary heat transfer pathways, bridging the gaps between the thermally conductive powder particles and providing continuous heat conduction routes through the resin matrix, thereby enhancing overall thermal conduction efficiency.
3Temperature
If conventional resin is used in copper foil substrates, then the dielectric layer can be formed, but the copper foil substrate has poor thermal conductivity
Solution Approach 1:
The patent uses a composite resin system containing thermally conductive fillers that maintains the dielectric layer formation capabilities of conventional resin while significantly enhancing thermal conductivity. The composite material preserves the ease of manufacturing properties of the base resin while adding thermal conduction functionality.
Solution Approach 2:
The thermally conductive resin composite serves multiple functions simultaneously: it maintains the dielectric properties necessary for insulation and circuit board functionality, provides thermal conduction pathways for heat dissipation, and preserves the ease of manufacturing characteristics of conventional resin systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high thermal conductivity, low dielectric constant, and low dielectric loss, suitable for advanced circuit boards and IC substrates, while maintaining tensile strength and preventing bursting.
Implementation Method 1
a surface modified by iron-containing oxide, and (d) inorganic filler is sheet-shaped or needle-shaped
Implementation Method 2
thermally conductive resin with a biphenyl group... to increase the thermal conductivity of the dielectric layer
Implementation Method 3
1.0 part by weight of (a) thermally conductive resin with a biphenyl group; 1.0 to 10.0 parts by weight of (b) polyphenylene oxide; 0.01 to 5.0 parts by weight of (c) hardener
Data Source
AI summary
A resin composition is provided, which includes 1 part by weight of (a) thermally conductive resin with a biphenyl group, 1.0 to 10.0 parts by weight of (b) polyphenylene oxide, 0.01 to 5.0 parts by weight of (c) hardener, and 0.1 to 5.0 parts by weight of (d) inorganic filler. (d) Inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide. (d) Inorganic filler is sheet-shaped or needle-shaped.