Resin Composition for High-Density PCBs Using Vinylene Carbonate Photoinitiator

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Solution Overview

Problem

Existing resin compositions for multilayer printed wiring boards face challenges due to poor light transmissivity of bismaleimide compounds, which hinders photocuring reactions and results in inadequate alkaline developability, limiting their use in high-density printed wiring boards.

Innovation Solution

A compound with a specific carboxyl group is used in the exposure and development steps, allowing for suitable curing without inhibiting photocuring reactions and imparting excellent alkaline developability to the resin composition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a bismaleimide compound is used as a curable resin, then the resin composition can be cured, but light transmissivity becomes poor, preventing sufficient light from reaching the photo initiator

Engineering Contradiction:
Improvecuring reliabilityVSAvoidlight transmissivity
Core Design Contradiction:
ReliabilityVSIllumination intensity

Solution Approach 1:

The patent uses a composite resin composition containing both bismaleimide compound (for curing reliability) and vinylene carbonate (for improved light transmissivity and photocuring). This composite approach allows the system to benefit from both materials: the bismaleimide provides thermal stability and cure strength, while vinylene carbonate enhances light penetration and acts as a photoinitiator, resolving the contradiction between curing reliability and light transmissivity.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

Vinylene carbonate serves as an intermediary substance that bridges the gap between light and the bismaleimide compound. It absorbs light effectively and generates radicals that initiate the curing of bismaleimide, allowing the system to achieve both good light transmissivity and reliable curing without requiring the bismaleimide itself to be transparent to light.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a bismaleimide compound is used as a curable resin, then the resin can be cured, but alkaline-developability becomes insufficient, leaving unexposed resin after development

Engineering Contradiction:
Improvecuring reliabilityVSAvoidalkaline-developability
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent creates a composite system where vinylene carbonate complements the bismaleimide compound by providing alkaline-developability. The vinylene carbonate-based cured product has different chemical properties than bismaleimide, allowing selective removal of unexposed areas with alkaline developers while preserving the exposed, crosslinked structure, thus enabling both reliable curing and good developability.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The resin composition exhibits different properties in exposed versus unexposed regions. In exposed areas, the resin is fully crosslinked and resistant to alkaline development. In unexposed areas, the resin remains partially soluble in alkaline developers. This local differentiation of properties enables successful photolithography patterns while maintaining overall curing reliability.

Inventive Principle:
Principle #3Local quality

3Reliability

If additional heating is performed before development to cure the maleimide compound, then curing is achieved, but heating prevents obtaining highly detailed resist patterns

Engineering Contradiction:
Improvecuring reliabilityVSAvoidpattern detail accuracy
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces thermal curing (heating) with photocuring (light irradiation). By using vinylene carbonate as a photoinitiator that generates radicals upon light exposure, the system achieves curing through photochemical reactions instead of thermal processes. This substitution eliminates the need for heating steps, allowing direct formation of high-resolution patterns without thermal distortion or loss of pattern detail.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the curing mechanism from thermal activation to photochemical activation. By selecting a photoinitiator (vinylene carbonate) that responds to light wavelengths suitable for high-resolution direct imaging, the system achieves curing at lower temperatures and with better spatial control, thereby improving pattern detail accuracy while maintaining curing reliability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of the specific carboxyl group compound enables efficient photocuring and excellent alkaline developability, facilitating the production of high-density multilayer printed wiring boards with improved performance.

Implementation Method 1

a photo radical polymerization initiator (a curing agent)

Methodology Applied
Scientific EffectPhotolysis: Photodissociation

Implementation Method 2

an exposed portion is cured by irradiation of rays of light

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS12312323B2Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
Publication Date: 2025.05.27 MITSUBISHI GAS CHEM CO INC
  • US12312323B2 patent drawing
  • US12312323B2 patent drawing
  • US12312323B2 patent drawing

AI summary

The compound (A) is represented by formula (1).R1O—R2—OR1  (1)(In formula (1), each R1 independently represents a group represented by formula (2), or a hydrogen atom, and R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms, provided that at least one R1 is a group represented by formula (2).)(In formula (2), -* represents a bonding hand.).