Thermally-Conductive Resin Composition Void Fraction Control
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Solution Overview
Problem
Existing thermally-conductive resin compositions face challenges in achieving a balance between high thermal conductivity and electrical insulating properties due to the need for special equipment and complex manufacturing processes, as well as the risk of void formation and deformation of inorganic fillers, which lowers thermal conductivity when increased filler content is used.
Innovation Solution
A thermally-conductive resin composition containing boron nitride particles with a specific void fraction range under compression pressure, ensuring a balance between thermal conductivity and electrical insulating properties by controlling the void fraction and compression behavior of the particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the content of inorganic fillers is increased to improve thermal conductivity, then thermal conductivity is improved, but voids are likely to occur and thermal conductivity and electrical insulating properties are lowered
Solution Approach 1:
The invention changes the particle size parameter of boron nitride fillers to a specific range (D10: 3-10 μm, D50: 15-30 μm, D90: 40-80 μm) to optimize both thermal conductivity and electrical insulating properties. This parameter optimization prevents void formation while maintaining high filler content (60-80 mass%), resolving the contradiction between improving thermal conductivity and maintaining electrical insulation.
2Manufacturing precision
If special equipment and complicated manufacturing process are used to control particle size of boron nitride, then particle size control is improved, but productivity and cost are lowered
Solution Approach 1:
The invention replaces expensive special equipment with conventional mixing equipment to achieve particle size control. By specifying a ready-made particle size distribution range for boron nitride fillers, the invention eliminates the need for complex particle size control equipment and processes, thereby improving productivity and reducing manufacturing costs while maintaining manufacturing precision.
3Reliability
If press pressure is increased to remove voids, then voids are removed, but boron nitride aggregates are deformed or collapsed and thermal conductivity is lowered
Solution Approach 1:
The invention performs preliminary action by selecting boron nitride fillers with an optimized particle size distribution before molding. This preliminary selection prevents void formation in the first place, eliminating the need for high press pressure during molding. The pre-optimized particle size range ensures dense packing that naturally minimizes voids without requiring aggressive pressurization that would deform aggregates and reduce thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent thermal conductivity and electrical insulating properties in molded articles, maintaining performance without the drawbacks of increased press pressure or complex manufacturing processes.
Implementation Method 1
various materials obtained by compounding a resin with an inorganic filler having high thermal conductivity have been studied... boron nitride particles exhibiting particularly high thermal conductivity... excellent thermal conductivity
Implementation Method 2
a thermally-conductive resin composition containing a thermosetting resin and boron nitride particles... obtained by curing the resin composition
Data Source
AI summary
Provided is a thermally-conductive resin composition containing a thermosetting resin and boron nitride particles, in which, in a case where a void fraction of the boron nitride particles relative to a compression pressure is measured, a void fraction at a compression pressure of 4 MPa is 30% or more and 60% or less, and a void fraction at a pressure of 8 MPa is 20% or more and 50% or less.