Resin Composition for Wafer Encapsulation
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Solution Overview
Problem
Current techniques for encapsulating semiconductor wafers face challenges such as wire deformation, short filling, and warpage, especially with the transition to larger diameter and thinner wafers, requiring a material that can provide effective encapsulation with minimal warpage and improved adhesion and protection.
Innovation Solution
A resin composition comprising a silicone resin, an epoxy resin curing agent, and a filler, which can be formed into a film for batch encapsulation of wafers, offering improved adhesion, low warpage, and enhanced protection, suitable for wafer-level packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transfer molding technique is used, then encapsulation can be achieved, but wire deformation occurs and short filling is more likely as encapsulation area becomes larger
Solution Approach 1:
The patent changes the physical state parameter of the resin from solid (conventional transfer molding) to liquid (new composition), allowing the resin to flow and conform to the wafer surface without causing wire deformation or short filling, even for large encapsulation areas
Solution Approach 2:
The patent creates a composite resin composition containing epoxy resin, silicone resin, and inorganic filler particles. This composite formulation provides both the flowability needed for complete filling and the mechanical properties needed for reliable encapsulation, resolving the contradiction between filling capability and structural integrity
2Ease of manufacture
If compression molding technique is used, then liquid resin can be molded, but it is difficult to precisely control the molding range at the end portion of the wafer
Solution Approach 1:
The patent replaces the mechanical compression molding system with a chemical curing system. The liquid resin is applied and then cured in place through chemical reaction, eliminating the need for precise mechanical control of molding range while achieving complete and uniform encapsulation
3Reliability
If wafer encapsulation is performed with conventional materials, then encapsulation can be achieved, but warpage becomes a problem with larger diameter and thinner wafers
Solution Approach 1:
The patent formulates a composite resin containing inorganic filler particles (such as silica) dispersed in an epoxy-silicone resin matrix. This composite structure provides thermal expansion matching and mechanical support that minimizes wafer warpage during and after the encapsulation process, enabling reliable packaging of large-diameter, thin wafers
4Area of stationary object
If encapsulation area is increased for larger wafers, then complete wafer coverage is achieved, but short filling becomes more likely
Solution Approach 1:
The patent changes the viscosity and flow characteristics of the resin by using a liquid formulation with appropriate molecular weight and adding low-viscosity modifiers. This allows the resin to flow completely across large wafer areas and fill all gaps, ensuring 100% filling reliability even for the largest encapsulation areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition ensures reliable and efficient encapsulation of large-diameter/thin wafers with minimal warpage and excellent protection, facilitating high-yield production of quality semiconductor devices.
Implementation Method 1
a silicone resin (A), (B) an epoxy resin curing agent
Implementation Method 2
a resin composition comprising (A) a silicone resin, (B) an epoxy resin curing agent
Implementation Method 3
a filler (C)
Implementation Method 4
a resin composition comprising (A) a silicone resin, (B) an epoxy resin curing agent, and (C) a filler
Data Source
AI summary
The present invention relates to a resin composition containing components (A), (B), and (C), component (A) being a silicone resin having a weight-average molecular weight of 3,000-500,000 and having constituent units represented by compositional formula (1), component (B) being an epoxy resin curing agent, and component (C) being a filler. The present invention is capable of providing a resin film and a resin composition whereby wafers can be molded (wafer molding) in batch fashion, the resin composition having good molding properties with respect to large-diameter thin-film wafers in particular while at the same time imparting low warpage after molding and good wafer-protective ability, the resin composition also facilitating the molding step and being suitable for use in wafer-level packaging.