Resin Composition for Low-Warping Wafer Packaging
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Solution Overview
Problem
Current wafer-level packaging technologies face challenges in molding large-diameter, thin-film wafers due to issues like short shots, warpage, and difficulty in controlling fluidity and adhesion, particularly with increasing wafer size and reducing thickness, which affects the sealing and protection properties.
Innovation Solution
A resin composition comprising a silicone resin with specific constitutional units, an epoxy resin-curing agent, and a filler, formulated to provide excellent adhesion, low-warping, and heat-resistant properties, allowing for effective wafer molding and packaging without the need for resin flow, and a method for producing a resin film and semiconductor device using this composition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transfer molding method using solid type epoxy resin is used, then sealing is achieved, but wire transformation and short shot occur due to resin flow in narrow portions
Solution Approach 1:
The invention changes the physical state parameter of the resin from solid to liquid, enabling the resin to flow and fill narrow portions effectively without causing wire transformation or short shot, while maintaining sealing quality through controlled liquid resin formulation
Solution Approach 2:
The invention uses a composite resin composition comprising liquid epoxy resin, silicone resin, and specific fillers to achieve both fluidity for complete filling and appropriate viscosity to prevent harmful effects during the molding process
2Ease of operation
If compression molding method using liquid type epoxy resin is used, then resin flow is improved, but it is difficult to finely control the molding range on end face portion and optimize fluidity
Solution Approach 1:
The invention optimizes the viscosity parameter of the liquid resin by adjusting the ratio of epoxy resin to silicone resin and selecting appropriate filler particle sizes, enabling both good flow into narrow portions and precise control of molding range on the end face portion
Solution Approach 2:
The invention uses fillers with different particle sizes (including fine particles of 10 μm or less) to achieve different local properties: larger fillers provide structural support while fine fillers enable precise filling and control of the molding range on the end face portion
3Productivity
If wafer diameter is increased and film thickness is reduced, then wafer level packaging is enabled, but warpage occurs and wafer protection property deteriorates
Solution Approach 1:
The invention uses a composite resin system with epoxy resin providing adhesion and structural support, silicone resin providing flexibility and stress distribution, and carefully selected fillers to create a molded product that maintains dimensional stability and protects thin-film wafers from warpage while enabling wafer level packaging
Solution Approach 2:
The invention adjusts the resin composition parameters including the ratio of epoxy to silicone resin, filler content and particle size distribution, to optimize the mechanical properties of the molded product for supporting large-diameter thin-film wafers and minimizing warpage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition enables high-quality semiconductor devices with reduced warpage and improved protection, adhesion, and reliability, suitable for large-diameter thin-film wafers, addressing the limitations of existing technologies in wafer-level packaging.
Implementation Method 1
a resin composition comprising: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000... (B) an epoxy resin-curing agent
Implementation Method 2
a resin composition comprising: (A) a silicone resin... (B) an epoxy resin-curing agent; and (C) a filler; wherein the mass fraction of the component (C) is 50 to 95% by mass
Data Source
AI summary
The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000; (B) an epoxy resin-curing agent; and (C) a filler; wherein the mass fraction of the component (C) is 50 to 95% by mass based on the total mass. This can provide a resin composition that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably.