Resin Composition Warp Suppression
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Solution Overview
Problem
Printed wiring boards face issues with size stability due to high linear thermal expansion coefficients, leading to cracks from thermal expansion and shrinkage, and filling with inorganic fillers increases elastic modulus, making warp suppression difficult.
Innovation Solution
A resin composition comprising a polyolefin epoxy resin with an epoxy equivalent of 200 g/eq or more, an epoxy resin with a condensed polycyclic aromatic hydrocarbon, a nitrogen-containing novolak resin with a nitrogen content of 13% or more, and an inorganic filler with a content of 60% or more, which together form a cured product with suppressed warp and superior crack resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the resin material is filled with a large amount of inorganic filler to lower the linear thermal expansion coefficient, then the thermal expansion coefficient is reduced, but the elastic modulus becomes so high that warp suppression becomes difficult
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system by introducing polyolefin epoxy resin with specific epoxy equivalent (200-400 g/eq) and nitrogen-containing novolak resin (13% nitrogen content or cresol novolak structure). This chemical parameter change allows achieving low thermal expansion coefficient without excessive elastic modulus by optimizing the resin matrix properties rather than relying solely on inorganic filler content
Solution Approach 2:
The patent creates a composite resin system combining multiple components: polyolefin epoxy resin (A), epoxy resin with condensed polycyclic aromatic hydrocarbon (B), nitrogen-containing novolak resin (C), and inorganic filler (D). This composite approach allows synergistic effects where the organic resin components provide flexibility and appropriate elastic modulus while the inorganic filler provides low thermal expansion, resolving the contradiction between these two properties
2Ease of manufacture
If the linear thermal expansion coefficient is high, then the resin material can be processed easily, but the resin material repeats expansion and shrinkage causing cracks due to strain
Solution Approach 1:
The patent optimizes the resin composition parameters by selecting polyolefin epoxy resin with epoxy equivalent of 200-400 g/eq and nitrogen-containing novolak resin with 13% nitrogen content or cresol novolak structure. These parameter specifications create a resin system that maintains appropriate processability while achieving low thermal expansion coefficient to prevent crack formation during thermal cycling
Solution Approach 2:
The patent converts the potential harm of thermal expansion into a benefit by carefully selecting inorganic filler content (60-80% by mass) and resin composition to achieve a balanced thermal expansion coefficient. The resin system is designed to expand and contract minimally with temperature changes, transforming the thermal expansion phenomenon from a source of cracks into a controlled property that maintains dimensional stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively suppresses warp and enhances crack resistance in printed wiring boards, ensuring stability and reliability across varying temperature environments.
Implementation Method 1
a resin material in the insulating layer repeats expansion and shrinkage, thereby causing a crack due to the resulting strain
Implementation Method 2
an insulating layer is formed by curing a resin composition
Data Source
AI summary
A resin composition includes (A) a polyolefin epoxy resin, (B) an epoxy resin having a condensed polycyclic aromatic hydrocarbon, (C) a nitrogen-containing novolak resin, and (D) an inorganic filler, in which an epoxy equivalent of the (A) component is 200 g/eq. or more, a nitrogen content in the (C) component is 13% by mass or more and/or the (C) component has a cresol novolak structure, and a content of the (D) component is 60% by mass or more on the basis of 100% by mass of non-volatile components in the resin composition.