Resin Composition Warpage Reduction
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Solution Overview
Problem
The semiconductor industry faces challenges with warpage and peeling issues in thin and flexible plastic substrates due to inadequate strength and adhesion of encapsulants, which can lead to cracks and reduced production efficiency.
Innovation Solution
A resin composition comprising silicone-modified epoxy resin, specific epoxy compounds, a phenolic curing agent, and a curing accelerator, along with an inorganic filler, is developed to enhance tensile strength, adhesion, and reduce warpage, forming a resin film that acts as a wafer mold material with improved chemical and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If phenol compound curing agents are used to improve encapsulant strength, then strength is improved, but warpage increases and adhesion deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the curing agent system by introducing a specific combination of phenolic curing agents ( compounds (D1) and (D2)) with controlled molecular weights and structures. This parameter change allows achieving both high strength and reduced warpage by optimizing the curing reaction characteristics to balance crosslinking density and shrinkage control.
Solution Approach 2:
The patent uses a composite curing agent system combining phenolic curing agents (D1) and (D2) with specific epoxy resin components (A, B, C). This composite approach creates a multi-functional curing system that simultaneously provides strength enhancement, warpage control, and adhesion improvement through synergistic chemical reactions.
2Strength
If phenol resin curing agents are used to improve encapsulant strength, then strength is improved, but adhesion deteriorates causing peeling
Solution Approach 1:
The patent optimizes the molecular weight and structural parameters of the phenolic curing agents (D1 and D2) to control the curing reaction characteristics. This parameter optimization ensures that the curing process produces strong crosslinked networks while maintaining good adhesion to substrate and chip surfaces, preventing peeling during bending.
Solution Approach 2:
The patent employs a composite resin system combining multiple epoxy resin components (A, B, C) with specific phenolic curing agents. This composite formulation creates a balanced cured material that achieves both high strength and excellent adhesion through multiple curing reactions that simultaneously strengthen the matrix and enhance interfacial bonding.
3Ease of manufacture
If liquid type encapsulant is used for square substrates, then ease of manufacture is improved, but unevenness occurs inside and outside the substrate
Solution Approach 1:
The patent changes the physical state parameter of the encapsulant from liquid to film form. This state change eliminates the unevenness problem inherent in liquid encapsulation of square substrates while maintaining ease of manufacture through simple film lamination processes. The film form provides uniform coverage without the flow-related irregularities of liquid types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition significantly improves the strength and adhesion of the cured material, reducing warpage and peeling, and provides excellent wafer protection, enabling high-quality semiconductor device manufacturing with improved yield and reduced stress.
Implementation Method 1
a resin composition comprising: (A) a silicone-modified epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3) ; (D) a phenolic curing agent; and (E) a curing accelerator
Implementation Method 2
a curing accelerator
Data Source
AI summary
The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, wherein "A" represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.