Resin Composition for Wiring Boards with Low Dielectric and Heat Resistance
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Solution Overview
Problem
Electronic substrate materials face challenges in achieving low dielectric properties, heat resistance, and low thermal expansion while minimizing surface tackiness, especially in the context of miniaturized and high-performance electronic devices where polyphenylene ether compounds exhibit large thermal expansion and heat resistance issues.
Innovation Solution
A resin composition comprising a hydrocarbon-based compound with an aromatic or aliphatic cyclic group and a styrenic polymer solid at 25°C, which together provide a cured product with excellent low dielectric properties, heat resistance, and low thermal expansion, while suppressing surface tackiness through the use of specific molecular weights and structural units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyphenylene ether compounds are used to achieve low dielectric properties, then low dielectric constant and low dielectric loss tangent are improved, but coefficient of thermal expansion increases and heat resistance deteriorates
Solution Approach 1:
The patent uses a composite resin composition containing both polyphenylene ether compound (for low dielectric properties) and polyether sulfone compound (for heat resistance and low thermal expansion). This composite approach allows the material to simultaneously achieve low dielectric constant, low dielectric loss tangent, good heat resistance, and low coefficient of thermal expansion that cannot be obtained with single materials.
2Ease of manufacture
If resin composition is wound as film or prepreg for storage, then ease of storage is improved, but surface tackiness increases causing films to stick together
Solution Approach 1:
The patent changes the physical state parameter of the styrenic polymer from liquid to solid at 25°C. This parameter change eliminates surface tackiness at storage temperature while maintaining the ability to form proper films and prepregs, allowing easy storage without sticking issues.
3Object-generated harmful factors
If styrenic polymer is used to suppress surface tackiness, then surface tackiness is reduced, but dielectric properties and thermal expansion properties may deteriorate
Solution Approach 1:
The patent creates a composite system where styrenic polymer (solid at 25°C) provides surface tackiness suppression, while polyphenylene ether compound provides low dielectric properties, and polyether sulfone compound provides heat resistance and low thermal expansion. The synergistic combination ensures all properties are maintained or improved.
Solution Approach 2:
The patent specifies precise parameter ranges for the styrenic polymer (solid at 25°C with specific glass transition temperature range) to ensure it suppresses tackiness without negatively affecting dielectric properties. The controlled parameters allow the styrenic polymer to contribute positively to overall performance.
Data Source
AI summary
An aspect of the present invention relates to a resin composition containing a hydrocarbon-based compound (A) represented by the following Formula (1) [In Formula (1), X represents a hydrocarbon group having 6 or more carbon atoms and containing at least one selected from an aromatic cyclic group or an aliphatic cyclic group, and n represents an integer from 1 to 10]; and a styrenic polymer (B) that is solid at 25° C. and is different from the hydrocarbon-based compound (A).