Resin Composition for Low Dielectric Wiring Boards
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Solution Overview
Problem
Wiring boards used in electronic equipment face challenges in maintaining low dielectric properties and high heat resistance, especially after water absorption, which affects signal transmission speed and reliability in high-frequency applications.
Innovation Solution
A resin composition containing a polymer with a specific structural unit and silica as an inorganic filler, where the silica has a limited ratio of Si atoms in silanol groups, is used to create a cured product with low dielectric properties and high heat resistance that maintains these properties even after water absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If vinyl groups are introduced to improve heat resistance, then heat resistance is improved, but dielectric properties deteriorate
Solution Approach 1:
The patent modifies the chemical structure of the resin by controlling the type and amount of vinyl groups introduced, and adjusts the vinyl group content to an optimal range (0.1-10 mmol/g) to achieve both heat resistance and low dielectric loss
Solution Approach 2:
The patent uses a composite resin system combining polyphenylene oxide with modified vinyl groups, creating a material that integrates the thermal stability of PPO with the crosslinking benefits of vinyl functionality to simultaneously achieve heat resistance and low dielectric properties
2Temperature
If inorganic filler content is increased to improve heat resistance, then heat resistance is improved, but dielectric properties deteriorate
Solution Approach 1:
The patent optimizes the particle size distribution of inorganic fillers (combining fine particles of 0.1-1 μm with coarse particles of 1-10 μm) and controls the filler content ratio to achieve dense packing that improves heat resistance while minimizing dielectric constant increase
3Reliability
If water absorption is reduced to maintain dielectric properties, then dielectric property stability is improved, but heat resistance may deteriorate
Solution Approach 1:
The patent introduces silane coupling agents as intermediary substances that chemically bond to both the inorganic filler surface and the organic resin matrix, creating a bridging layer that prevents water penetration pathways while maintaining the thermal stability of the composite structure
Solution Approach 2:
The patent creates a multi-phase composite structure with hydrophobic modified polyphenylene oxide matrix, surface-treated inorganic fillers, and silane coupling agent interfacial layers, forming a water-resistant network that preserves both dielectric stability and heat resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively reduces dielectric constant and loss tangent, enhancing signal transmission speed and reliability in high-frequency applications while maintaining heat resistance and mechanical stability.
Implementation Method 1
silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less
Data Source
AI summary
A resin composition is provided containing a polymer having a structural unit represented by the following Formula (1) in the molecule, and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less.In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.