Resin Cooling Structure With Bus Bar Isolation Gap
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling structures for electronic components in vehicles lack effective insulating properties between the bus bar and the flow path configuration member, which can lead to reduced cooling efficiency and increased weight.
Innovation Solution
A cooling structure that includes a flow path configuration member made of resin, a heat diffuser embedded or joined to the flow path configuration member, and cooling fins extending from the heat diffuser into the flow path, with a bus bar configured to transfer heat to the heat diffuser while maintaining a space between the bus bar and the flow path configuration member for improved insulating properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the bus bar is thermally joined to a cooling structure with cooling fins, then cooling efficiency is improved, but insulating properties between the bus bar and flow path configuration member deteriorate
Solution Approach 1:
The cooling structure is segmented into distinct functional zones: a heat diffuser portion that contacts the bus bar for heat absorption, and a cooling fin portion that extends into the refrigerant flow path for heat dissipation. This segmentation allows thermal contact where needed while maintaining insulation where required, resolving the contradiction between cooling efficiency and insulating properties.
Solution Approach 2:
The heat diffuser acts as an intermediary component between the bus bar and the cooling fins. It thermally connects to the bus bar to absorb heat, then transfers this heat to the cooling fins which dissipate it to the refrigerant. This intermediary structure enables thermal management while maintaining electrical insulation between the bus bar and the flow path configuration member.
2Temperature
If a heat sink is provided immediately below an electronic component, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The cooling structure merges multiple functions into a single integrated component: the heat diffuser portion serves as both a thermal interface with the bus bar and a structural element, while the cooling fins provide heat dissipation. This merging eliminates the need for separate heat sink components, reducing device complexity while maintaining cooling efficiency.
Solution Approach 2:
The cooling structure exhibits multi-functionality by simultaneously serving as a heat absorption interface (heat diffuser portion contacting the bus bar), a heat transfer medium (through the fins), and a structural support element. This universal design reduces the number of separate components needed, thereby reducing device complexity while achieving effective cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed cooling structure achieves excellent insulating properties between the bus bar and the flow path configuration member, enhancing cooling efficiency while reducing weight and complexity.
Implementation Method 1
a bus bar (26) configured to transfer heat to the heat diffuser (34)
Implementation Method 2
a flow path (12) through which a refrigerant flows
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A cooling structure includes a flow path configuration member including resin and forming a flow path through which a refrigerant flows, a heat diffuser having a plate shape and embedded in the flow path configuration member or joined to the flow path configuration member, one or more cooling fins extending from the heat diffuser into the flow path, and a bus bar configured to transfer heat to the heat diffuser, in which the flow path configuration member and the bus bar are not in contact with each other with a space interposed between an outer wall surface of the flow path configuration member and the bus bar.