Resin Composition Conveying and Cooling With −40 to 0°C Air
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Solution Overview
Problem
Existing cooling apparatuses for resin compositions have low cooling efficiency, taking a long time to cool resin compositions from 40 to 50°C, resulting in inefficient processing.
Innovation Solution
A cooling apparatus with a conveying means and cooling means that conveys and cools resin compositions at a rate of 0.2 to 5°C/min, using cooling air between -40 to 0°C, with a humidity of ≤10% and pressure ≥0.2 MPa, discharged through multiple nozzles along the conveying direction to efficiently cool the resin composition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling air at 0 to 15°C is used to cool the resin composition, then the resin composition can be cooled, but the cooling efficiency is low and it takes a long time to sufficiently cool the resin composition
Solution Approach 1:
The patent changes the temperature parameter of the cooling air from 0-15°C to -40 to 0°C, and adjusts the humidity parameter to 10% or less. This parameter change enables efficient cooling of the resin composition at a cooling rate of 0.2 to 5°C/min, resolving the contradiction between using mild cooling temperatures and achieving high cooling efficiency.
2Loss of time
If the resin composition is cooled from 40 to 50°C using conventional cooling methods, then the cooling process can be completed, but the processing time is excessive
Solution Approach 1:
The patent applies parameter changes by using cooling air at -40 to 0°C with humidity of 10% or less, which achieves a cooling rate of 0.2 to 5°C/min for resin composition initially at 40-50°C. This dramatically reduces cooling time and eliminates the contradiction between completing the cooling process and maintaining high processing efficiency.
3Productivity
If cooling air is discharged through nozzles to the resin composition, then cooling can be achieved, but the cooling uniformity and efficiency are insufficient
Solution Approach 1:
The patent applies local quality by discharging cooling air from multiple nozzles positioned at different locations to cool different regions of the resin composition. This ensures uniform cooling across the entire resin composition while maintaining high cooling efficiency, resolving the contradiction between cooling efficiency and cooling uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently cools resin compositions from 40 to 50°C, transforming them into a hardened state for reliable pulverization, preventing metal contamination and ensuring satisfactory properties for semiconductor packaging.
Implementation Method 1
a cooling means which cools the resin composition being conveyed by the conveying means... the cooling means has a fan section having at least one outlet port which discharges cooling air of which temperature is in the range of −40 to 0° C. to the resin composition being conveyed
Data Source
AI summary
A cooling apparatus includes a conveying means which conveys a resin composition formed into a sheet shape along a direction parallel to a surface of the sheet-shaped resin composition and a cooling means which cools the resin composition being conveyed by the conveying means. A temperature of the resin composition just before being cooled by the cooling means is in the range of 40 to 60° C. and the cooling means has a cooling ability to cool the resin composition such that a cooling rate of the resin composition is in the range of 0.2 to 5° C./min. Further, the cooling means includes a fan section having at least one outlet port which discharges cooling air of which temperature is in the range of −40 to 0° C. to the resin composition.