Resin Cooling Manifold Layout for Simpler Multi-Circuit Routing
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Solution Overview
Problem
Existing cooling modules for electric vehicles require complex routing of cooling circuits due to the need for independent circuits for devices with different operating temperatures, limiting design flexibility and complicating pipe placement.
Innovation Solution
A cooling module with a manifold made of resin, comprising multiple housings joined together, featuring channels and spare chambers, which aligns inflow and outflow ports to reduce pipe complexity and allow integration of auxiliary units like pumps and valves, thereby simplifying channel configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are mounted on the reserve tank according to its shape, then the mounting space is limited to the surface of the reserve tank, but this restricts the positions and directions of channel ports and reduces design flexibility
Solution Approach 1:
The manifold is divided into multiple housings (first housing, second housing, third housing) that can be joined together in different configurations. This segmentation allows the system to maintain manufacturing simplicity for each individual housing while achieving design flexibility through various joining arrangements of multiple housings.
Solution Approach 2:
The manifold extends in the vertical direction by stacking multiple housings, utilizing the third dimension (height) rather than only expanding horizontally. This dimensional approach allows ports to be positioned at different heights and orientations, significantly increasing design flexibility while keeping each housing relatively compact and manufacturable.
2Reliability
If independent cooling circuits are used for devices with different operating temperatures, then each device can operate at its appropriate temperature, but the routing of cooling circuit pipes becomes complicated
Solution Approach 1:
Multiple cooling circuits for different devices are merged into a single integrated manifold structure. The manifold contains multiple channels that can be configured to serve different devices with different temperature requirements, eliminating the need for separate pipe routes and reducing overall system complexity while maintaining reliable temperature control.
Solution Approach 2:
The manifold is designed as a universal component that can accommodate multiple cooling circuits within a single structure. By configuring different channels and port arrangements, the same manifold can serve various devices with different temperature requirements, making the system multi-functional without requiring separate dedicated pipe routes for each device.
Data Source
AI summary
A cooling module includes a manifold made of resin and including a plurality of housings each having a joint portion joined to each other, in which the manifold includes a plurality of channels formed across at least two of the plurality of housings, a joining surface of each joint portion of the two joined housings among the plurality of housings is an end surface of a partition wall partitioning inside of the housing into the plurality of channels and a plurality of spare chambers, and the partition wall is erected from a bottom surface of each of the two housings.