Resin Cooling Plate for Semiconductor Thermal Stress Reduction
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Solution Overview
Problem
Semiconductor devices with metal cooling plates experience stress and detachment issues due to differences in linear expansion coefficients, leading to chronological deterioration of cooling performance.
Innovation Solution
The use of resin-based cooling plates with heat transfer fillers, oriented in an elongated shape to enhance heat transfer, and bonded to resin packages with excellent bonding performance, reducing stress and detachment risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal cooling plate is used, then heat transfer performance is improved, but stress and detachment occur due to linear expansion coefficient differences
Solution Approach 1:
The patent changes the material parameter of the cooling plate from metal to resin, specifically selecting resin with a linear expansion coefficient closer to that of the resin package. This parameter change reduces the expansion coefficient difference, thereby minimizing thermal stress and preventing detachment while maintaining adequate heat transfer performance through filler incorporation.
Solution Approach 2:
The patent employs composite materials by incorporating heat transfer fillers (such as aluminum oxide, aluminum nitride, or boron nitride) into the resin matrix. This composite structure enables the cooling plate to achieve both mechanical compatibility with the resin package (reducing stress) and sufficient thermal conductivity for effective heat dissipation.
2Reliability
If resin cooling plates with heat transfer fillers are used, then bonding stability is improved, but heat transfer performance may be reduced
Solution Approach 1:
The patent resolves this contradiction by creating a composite material system where heat transfer fillers (aluminum oxide, aluminum nitride, or boron nitride) are dispersed within the resin matrix. The filler content is optimized to achieve sufficient thermal conductivity while maintaining the resin's bonding advantages. The composite structure allows the cooling plate to simultaneously achieve mechanical compatibility for stable bonding and adequate thermal performance for effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains high cooling efficiency and prevents chronological deterioration of cooling performance by minimizing thermal stress and detachment of the cooling plates from the resin packages.
Implementation Method 1
The cooling plate may be constituted of resin containing heat transfer fillers
Implementation Method 2
the cooler may be configured to flow coolant along the fins
Implementation Method 3
The metal such as aluminum has quite different linear expansion coefficients from those of resin. Due to this difference in the linear expansion coefficients, stress is generated
Data Source
AI summary
A semiconductor device may include: a semiconductor module in which a semiconductor element is sealed in a resin package, and a heat sink is located on at least one surface of the resin package; an insulating sheet covering the heat sink; a cooling plate which is constituted of resin containing heat transfer fillers, the cooling plate having one surface and another surface, wherein the one surface covers the insulating sheet and is bonded to the at least one surface of the resin package, the other surface is provided with fins; and a cooler constituted of resin and configured to flow coolant along the fins, wherein the cooler surrounds the cooling plate in a view along a normal direction of the cooling plate, and is bonded to both ends of the resin package in the view along the normal direction.