Resin Core Terminal Flatness Control for Semiconductor Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for manufacturing semiconductor devices with resin core external connection terminals and electro-conductive films face issues of deformation, cracking, and elevated resistivity during the molding process, which can degrade the reliability of connections between the terminals and the mounting substrate.
Innovation Solution
The method involves forming flat portions on the top surfaces of resin projections before curing, using a molding jig with a flat surface, and then forming an electro-conductive film over the projections, ensuring the film is not ruptured or cracked, and maintaining the flatness and alignment of the terminal heads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If molding is performed after the electro-conductive layer is formed, then the resin projections can be shaped to the desired form, but the electro-conductive film may deform, rupture, or crack causing elevated resistivity and degraded connection reliability
Solution Approach 1:
The patent applies preliminary action by forming flat portions on the resin projections before the electro-conductive layer is deposited. The molding jig presses the resin projections to create flat surfaces while the resin is still in its uncured state, allowing easy deformation. This preliminary shaping ensures that when the electro-conductive layer is subsequently formed, the underlying resin surface is already flat, preventing film rupture or cracking and maintaining connection reliability.
2Shape
If molding is performed after the electro-conductive layer is formed, then the resin projections can be shaped, but the electro-conductive film may rupture or crack to elevate resistivity
Solution Approach 1:
The patent performs the molding action preliminarily, before electro-conductive layer formation. The molding jig creates flat portions on the resin projections while the resin is soft and uncured. This preliminary flatness preparation ensures that the subsequent electro-conductive layer deposition occurs on a flat surface, preventing film rupture, cracking, and resistivity elevation.
3Strength
If the resin projections are molded after curing, then the structural integrity is maintained, but the molding process requires high pressure that may damage the electro-conductive film
Solution Approach 1:
The patent performs molding preliminarily while the resin is uncured and soft, requiring minimal pressure. The molding jig creates flat portions on the resin projections before curing. After the resin is cured and gains structural integrity, no additional high-pressure molding is needed, as the flat portions are already formed. This eliminates the harmful high pressure that would otherwise be required and could damage the electro-conductive film.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents the electro-conductive film from rupturing or cracking, maintaining the reliability of connections between the external connection terminals and the mounting substrate, ensuring consistent height and alignment of terminal heads for proper mounting.
Implementation Method 1
wherein the plurality of projections are cured
Data Source
AI summary
A plurality of projections, respectively given later as cores of a plurality of external connection terminals, are formed first by selectively forming a curable resin layer over a protective insulating film; flat portions are then formed respectively on the top surfaces of the plurality of projections, by pressing a molding jig having a flat opposing surface onto the top surfaces of the plurality of projections, before the projections are cured; the plurality of projections are cured; and the plurality of external connection terminals, and the plurality of interconnects are formed, by selectively forming an electro-conductive film over the plurality of projections, the protective insulating film, and the plurality of electrode pads.