Resin-Coupled Display Back Cover for Drooping Resistance
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Solution Overview
Problem
Existing organic light-emitting display devices face challenges in reducing thickness and improving heat dissipation while maintaining resistance to drooping, which limits their lifespan and portability.
Innovation Solution
A display device design that incorporates a resin layer to couple and fix the display panel and back cover, along with a through-hole in the cover shield for the IC chip, allowing for reduced thickness and enhanced heat dissipation through graphite parts and improved adhesion, thereby increasing drooping resistance and lifespan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of display panel and back cover is reduced to make the device thinner and lighter, then the portability and aesthetics are improved, but the heat dissipation performance deteriorates and drooping resistance decreases
Solution Approach 1:
The patent divides the back cover into multiple sections: a first back cover portion, a second back cover portion, and a third back cover portion. The resin layer is selectively applied only in specific regions (first and second regions) rather than uniformly across the entire back cover, allowing localized reinforcement for heat dissipation and drooping resistance while maintaining overall thinness in other areas.
Solution Approach 2:
The patent applies different properties to different regions of the back cover by selectively positioning the resin layer in specific areas where heat dissipation and structural support are most needed, rather than uniformly thickening the entire back cover. This localized approach maintains the device's overall thin profile while addressing specific performance requirements.
2Length of moving object
If the thickness of display panel and back cover is reduced to make the device thinner and lighter, then the portability and aesthetics are improved, but the drooping resistance decreases
Solution Approach 1:
The back cover is segmented into multiple functional regions, with the resin layer strategically positioned in the first and second regions to provide structural reinforcement. This segmentation allows the device to maintain thinness in non-critical areas while gaining drooping resistance where needed.
Solution Approach 2:
The patent combines the resin layer material with the back cover material to create a composite structure. The resin layer acts as a reinforcing composite material that enhances the mechanical strength and drooping resistance of the back cover without significantly increasing its thickness.
3Reliability
If a resin layer is added to improve heat dissipation and drooping resistance, then the lifespan is extended, but the weight and thickness increase
Solution Approach 1:
The resin layer is applied selectively in specific regions rather than covering the entire back cover, minimizing the amount of additional material used. This segmentation approach extends the device lifespan through improved heat dissipation and structural support while keeping the weight increase to a minimum.
Solution Approach 2:
The resin layer is positioned only in regions where heat dissipation and structural reinforcement are most beneficial, avoiding unnecessary material addition in areas where it is not needed. This localized application maintains the device's lightweight characteristics while achieving the desired reliability improvements.
4Reliability
If a resin layer is added to improve heat dissipation and drooping resistance, then the lifespan is extended, but the thickness of back cover increases
Solution Approach 1:
The resin layer is confined to specific regions (first and second regions) of the back cover rather than being applied uniformly. This segmentation allows the back cover to maintain its thin profile in most areas while providing localized thickness enhancement only where heat dissipation and drooping resistance require additional support.
Solution Approach 2:
The back cover exhibits non-uniform thickness distribution, with the resin layer adding thickness only in strategically important regions. This local quality approach ensures that the overall back cover remains thin and aesthetically pleasing while providing enhanced reliability in specific functional areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a thinner, lighter display device with significantly reduced drooping and improved heat dissipation efficiency, extending the device's lifespan and reducing maintenance costs.
Implementation Method 1
a resin layer for coupling and fixing the back cover and the display panel to each other
Implementation Method 2
improved heat dissipation through graphite parts
Data Source
AI summary
A display device includes a display panel and a back cover coupled and fixed to each other via a resin layer to manufacture a lightweight, thin display device having a slim bezel while increasing the drooping resistance of the display device. In addition, since the drooping resistance of the display device is increased, it is possible to reduce the thickness of the back cover, whereby it is possible to further reduce the weight of the display device. Furthermore, a through-hole is formed in a cover shield such that a portion of the upper part of an IC chip of a substrate can be inserted into the through-hole, with the result that the coupling structure of a circuit unit is improved, whereby it is possible to further reduce the thickness of the display device.